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YCS 2015 Desoldering Wick 1pcs

YCS 2015 Desoldering Wick 1pcs

Regular price Rs.300.00 PKR
Regular price Sale price Rs.300.00 PKR
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The YCS 2015 Desoldering Wick is a 2.0mm width, 1.5m length pure copper braid built for technicians who need clean, fast solder removal on mobile phone motherboards. It absorbs excess solder efficiently during IC removal, jumper work, and board-level repair, leaving low residue behind. The flat needle weaving design resists fraying, so it holds up through repeated passes on your repair bench. RoHS compliant and safe for daily workshop use, this wick fits directly into ISP, eMMC, and general soldering workflows where a dead phone or hardware fault needs a clean board before rework begins.

SKU:MST-SOLDERING-ACCESSORIES-457

⚖️ Weight: 0.01 kg

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Description

Every GSM technician knows a rework job is only as good as the board prep before it, and that is exactly where the YCS 2015 Desoldering Wick earns its place on the bench. Cut from pure copper wire and woven 2.0mm wide across a 1.5m length, this wick pulls molten solder off pads, pins, and traces without leaving behind the sticky residue that slows down cleaning afterward. When you are chasing a dead after flash issue or removing an IC before a reball, the last thing you want is a wick that clogs or drags — this one absorbs cleanly and lifts away with the solder already gone.The flat needle weaving construction is not a marketing detail, it is the reason this wick keeps its shape under heat instead of flattening out or splitting apart after a few passes. You get consistent tin absorption from the first pull to the last, which matters when you are working through a stack of boards in a busy repair shop rather than fixing one phone at a time. High thermal conductivity means the wick reaches working temperature fast once your soldering iron tip touches it, so you are not holding heat on a component longer than necessary — a real concern when you are pulling a CPU or eMMC chip and cannot afford collateral damage to nearby parts.In a typical workshop workflow, this wick shows up right before or after ISP pinout work, eMMC and UFS chip swaps, and general board cleaning ahead of reballing. If a board comes in with a boot loop issue traced back to a bad joint, or a charging issue that turns out to be a bridged pad, the wick is what clears the old solder so you can lay down a fresh, reliable joint. It also earns its place during display problem and network issue repairs where a chip needs to come off and go back on cleanly, since leftover solder blobs are a common cause of intermittent faults after a reflow.Because the braid is pure copper, it stays flexible enough to conform to tight spaces around densely packed components, which is exactly where you need it most — small mobile boards do not leave much room for error. The RoHS compliance means you are not introducing questionable materials onto boards you are trying to repair, which matters for both your health during long soldering sessions and the long-term reliability of the repair. This is a consumable, not a one-time buy, so having a wick that performs the same way pass after pass keeps your bench workflow predictable instead of forcing you to compensate with more flux or more heat than the job actually needs.For technicians running FRP lock, pattern unlock, or software marna jobs that later reveal a hardware fault requiring board-level work, this wick becomes part of the standard toolkit alongside your hot air station and microscope. It pairs naturally with ISP pinout tools, eMMC programmers, UFS adapters, and reballing kits, since none of those tools are useful on a board still covered in old solder. Whether you are training on your first reball or running a service center handling volume repairs daily, the YCS 2015 gives you a dependable, low-residue way to prep boards before the real repair work begins.

Key Features

Pure copper braid for strong, consistent tin absorption

Flat needle weaving design resists fraying during repeated use

Low residue after use, reducing post-repair cleanup time

High thermal conductivity for fast heat transfer from the soldering iron

RoHS compliant construction, safe for regular workshop use

Flexible braid conforms to tight, densely packed board areas

Reliable performance across ISP, eMMC, and UFS repair workflows

Suitable for both training use and high-volume service center work

Specifications

Brand Entity YCS
Product Entity Desoldering Wick 2015
Technology Entity Copper Braid Solder Absorption
Compatible Device Entities Universal Mobile PCB / Motherboard
Repair Process Entity PCB Desoldering, IC Removal, Reballing Prep
Industry Entity Mobile Repair Industry, PCB Repair

Compatible Devices

Universal — not device-specific. Suitable for use on any mobile phone, tablet, or PCB motherboard regardless of brand or chipset, since the wick works on solder joints rather than specific device models.

Common Repair Uses

IC removal and reballing prep, eMMC/UFS chip desoldering, CPU and chip-level rework, board cleaning before reflow, jumper and bridge removal, general PCB solder cleanup during dead phone and hardware fault repairs.

FAQ

What is the product name?
The product name is YCS 2015 Desoldering Wick.
What is the brand of this product?
The brand of this product is YCS.
What is the model of this product?
The model of this product is 2015.
What is this product used for?
This product is used for absorbing excess solder during IC removal, chip desoldering, and PCB cleaning before rework.
Which devices are compatible with this product?
This product works on any mobile phone or PCB motherboard, since it is a universal solder-absorbing wick rather than a device-specific tool.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does the YCS 2015 wick leave residue after use on the board?
No, it is built as a low-residue wick, so cleanup after desoldering takes less time and effort compared to standard braids.
Can this wick be used for eMMC or UFS chip removal on mobile motherboards?
Yes, its 2.0mm width and pure copper construction make it suitable for chip-level desoldering work including eMMC and UFS removal.