YCS 2015 PLUS Desoldering Wick (5pcs Roll)

Every board-level job on a dead phone reaches the same point: you lift the chip, and the pads underneath carry uneven leftover solder that will ruin your next placement if you leave it. The YCS 2015 PLUS Desoldering Wick (5pcs Roll) handles exactly that cleanup step, and it handles it well enough that you stop fighting the board. Each roll carries roughly 1.5m of 2.0mm wide braided pure copper, and the model number follows that logic, with 20 pointing to the 2.0mm width and 15 to the 1.5m length. That width suits the pad areas you meet daily on Android and iPhone logic boards, from PMIC and charging IC footprints to CPU and eMMC BGA fields, without spreading heat across a wider zone than the job needs. The braid carries a rosin-based flux, so the moment your iron tip melts the solder underneath, the flux activates and capillary action draws the solder up into the copper strands. Pure copper moves heat quickly, which means you get a faster pull at a moderate iron temperature and spend less time dwelling on fragile pads, the real cause of lifted pads and torn traces on thin multilayer boards. The workflow stays simple on the repair bench. Add a touch of fresh flux to the pad area, lay a clean section of wick flat across the pads, press your soldering iron tip lightly on top, and drag the wick slowly across the surface once the solder flows. Lift the iron and wick together so the braid never cools onto the board, then trim the used end with a cutter and move to fresh copper for the next pass. Avoid hard pressure and long contact time; a light touch with steady heat delivers flat, shiny pads ready for new solder balls or a fresh IC. On BGA work this matters most, because a flat pad field is the foundation of a good reball and a stable chip placement, and an uneven pad is a common reason a phone comes back with the same charging issue, network issue, or boot loop issue after an IC change. Technicians use this wick across a wide range of daily faults. You clear solder bridges on charging connector pins after a port replacement, clean the pads under a removed PMIC when a phone shows a no-power hardware fault, prep the eMMC or UFS footprint before you place a programmed chip, and tidy up FPC connector pins when a display problem traces back to a damaged connector. It also helps when you remove excess solder from shield frame edges or clean old joints on audio and RF IC pads before you rework a network issue. Because the pack holds five rolls, a busy repair shop keeps one roll at each bench and still has spares in the drawer, so nobody stops mid-job because the wick ran out. The YCS 2015 PLUS Desoldering Wick fits naturally into a complete rework setup. Pair it with a temperature-controlled soldering station and a fine chisel or knife tip for the best heat transfer, and use a hot air station to lift the IC before you start the cleanup. A quality flux paste improves results on oxidized or old lead-free joints, and a PCB holder keeps the board steady while you drag the wick across tight BGA areas. Once your pads are clean, a reballing kit with the correct stencil takes over the next stage, and a microscope lets you confirm every pad sits flat with no bridges or residue. For shops that handle heavy CPU and baseband rework, the wider YCS 3520 wick at 3.5mm makes a sensible upgrade for large pad areas and shield ground planes, while the 2.0mm size stays your everyday choice for precise mobile board work. For Pakistani technicians who want dependable consumables at a fair price in Pakistan, this pack delivers consistent wicking from roll to roll and keeps your board-level repairs clean, fast, and repeatable.