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Brand: YCS

YCS 2020 PLUS Desoldering Wick (5pcs Roll)

YCS 2020 PLUS Desoldering Wick (5pcs Roll)

Regular price Rs.1,650.00 PKR
Regular price Sale price Rs.1,650.00 PKR
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The YCS 2020 PLUS Desoldering Wick (5pcs Roll) gives you a 2.0 mm pure copper braid loaded with rosin flux for fast, clean solder removal on mobile phone motherboards. Each roll carries 2.0 m of braid, and the 5-roll pack keeps a fresh spool ready on your repair bench. You get quick solder pickup on charging IC pads, PMIC footprints, connector pins, and CPU or eMMC pad areas before reballing. The fine copper weave pulls heat into the joint quickly, so you spend less time on each pad and protect nearby components. A practical, budget-friendly consumable for repair shops and technicians across Pakistan.

SKU:MST-SOLDERING-ACCESSORIES-679

⚖️ Weight: 0.01 kg

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Description

Every board-level job on your repair bench ends with the same step: clearing old solder off the pads before the new part goes down, and the YCS 2020 PLUS Desoldering Wick (5pcs Roll) handles that step cleanly without dragging the job out. The braid measures 2.0 mm wide, a width that matches the pad rows you see daily on mobile motherboards, from charging IC footprints and PMIC pads to the ground rails around a CPU area. Each roll holds 2.0 m of braid, so you get plenty of fresh copper before you need a new spool, and the 5-roll pack keeps backups in the drawer when one runs out in the middle of a busy day. YCS weaves this wick from pure copper strands and coats it with rosin flux, so the copper carries heat into the joint quickly and the flux wets the solder the moment it melts. Your technique stays simple: lay the braid flat on the pad, press the soldering iron tip on top, and let the molten solder climb into the weave. When the section under the tip turns silver and full, trim it with side cutters and move to clean copper, because a saturated section stops absorbing and only spreads heat across the board. Lift the iron and the wick together, and never drag the braid across the pads, since dragging scratches the pad surface and can rip a weak pad straight off an old board. The fine weave matters most on modern phones, where lead-free solder sits on tiny pads that lift if you hold heat too long, and faster wicking means shorter contact time, which protects pads, vias, and the small passives sitting next to your work area. On older boards with oxidized solder, a small dab of fresh flux on the pad before you lay the wick down makes the solder release much more willingly. In a real workshop flow, you reach for this wick right after you remove an IC with your hot air station, because the leftover solder bumps on the pads stop the new chip from sitting flat. A charging issue repair that needs a charging IC replacement, a dead phone that needs a fresh PMIC, or a network issue that traces back to an RF IC all follow the same pattern: lift the old chip, wick the pads flat and shiny, inspect under the microscope, then place and reflow the new part. The same applies before reballing work on CPU and eMMC chips in boot loop and hang on logo cases, where flat, clean pads decide whether your stencil sits evenly and your new balls form properly. Display problem jobs often come down to bridged connector pins after a careless repair, and a short pass with the 2.0 mm braid clears the bridge without touching the plastic housing of the connector. For best results, set your soldering station to the temperature your solder alloy needs, use a clean, well-tinned tip with a wide contact face, and hold the board steady in a PCB holder so your hand stays free for the wick. After cleaning, a quick check with your multimeter confirms that no hidden bridge remains between pads before you power the board. This wick sits inside the soldering consumables category at KB GSM Store, alongside flux, solder paste, and solder wire, and it pairs naturally with soldering stations, hot air stations, microscopes, reballing kits, and PCB holders that already live on your bench. When your work moves toward large ground planes, shield frames, or wide motherboard pads, the YCS 3520 wick with a 3.5 mm width makes a sensible next step, while the 2.0 mm YCS 2020 PLUS stays your everyday choice for IC-level precision. For repair shops in Lahore, Karachi, Islamabad, and every other city, keeping a 5-roll pack in stock means you never stop a paid job because the braid ran out, and the price in Pakistan stays friendly enough to treat the wick as a daily consumable rather than a tool you ration.

Key Features

  • 2.0 mm braid width suited to IC pads, connector pins, and fine-pitch mobile board work
  • 2.0 m braid length per roll for extended use before replacement
  • 5-roll pack for continuous workshop supply
  • Pure copper weave for quick heat transfer into the solder joint
  • Rosin flux coating for fast solder wetting and pickup
  • Short contact time that helps protect pads and nearby components from heat damage
  • Leaves pads flat and clean for IC placement and reballing
  • Works with any standard soldering iron or soldering station

Specifications

Brand Entity YCS
Product Entity YCS 2020 PLUS Desoldering Wick (5pcs Roll)
Technology Entity Rosin flux-coated pure copper desoldering braid
Compatible Device Entities Mobile phone motherboards, PCBs, soldering irons and soldering stations
Repair Process Entity Solder removal, pad cleaning, IC replacement preparation, BGA reballing preparation
Industry Entity Mobile phone repair and PCB rework

Compatible Devices

  • Universal — not device-specific
  • Mobile phone motherboards of all brands for pad and pin cleaning
  • General electronic PCBs, including tablet and small-device boards
  • Any temperature-controlled soldering iron or soldering station

Common Repair Uses

  • Cleaning pads after removing charging ICs, PMICs, and audio ICs
  • Pad preparation before CPU and eMMC reballing
  • Removing solder bridges from FPC connector pins
  • Clearing excess solder after component replacement
  • Flattening pads before placing a new RF or network IC
  • Cleaning solder from small SMD component footprints

FAQ

What is the product name?
The product name is YCS 2020 PLUS Desoldering Wick (5pcs Roll).
What is the brand of this product?
The brand of this product is YCS.
What is the model of this product?
The model of this product is 2020 PLUS.
What is this product used for?
This product is used for removing solder from pads, pins, and joints on mobile phone motherboards and other PCBs.
Which devices are compatible with this product?
This product is compatible with mobile phone motherboards and general PCBs, and it works with any standard soldering iron or soldering station. It is universal and not device-specific.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Can the YCS 2020 PLUS desoldering wick remove lead-free solder from phone boards?
Yes. The copper braid absorbs any solder once your iron melts it, including lead-free alloys. Lead-free solder needs more heat, so use a properly set station and add a little extra flux on old or oxidized pads for a cleaner pull.
Which desoldering wick width works best for CPU and eMMC pad cleaning before reballing?
A 2.0 mm wick like the YCS 2020 PLUS suits most CPU, eMMC, and IC pad areas because it gives you control over small pad rows. For wide ground areas or shield frames, a 3.5 mm wick such as the YCS 3520 covers more surface per pass.