Every board-level job on your repair bench ends with the same step: clearing old solder off the pads before the new part goes down, and the YCS 2020 PLUS Desoldering Wick (5pcs Roll) handles that step cleanly without dragging the job out. The braid measures 2.0 mm wide, a width that matches the pad rows you see daily on mobile motherboards, from charging IC footprints and PMIC pads to the ground rails around a CPU area. Each roll holds 2.0 m of braid, so you get plenty of fresh copper before you need a new spool, and the 5-roll pack keeps backups in the drawer when one runs out in the middle of a busy day. YCS weaves this wick from pure copper strands and coats it with rosin flux, so the copper carries heat into the joint quickly and the flux wets the solder the moment it melts. Your technique stays simple: lay the braid flat on the pad, press the soldering iron tip on top, and let the molten solder climb into the weave. When the section under the tip turns silver and full, trim it with side cutters and move to clean copper, because a saturated section stops absorbing and only spreads heat across the board. Lift the iron and the wick together, and never drag the braid across the pads, since dragging scratches the pad surface and can rip a weak pad straight off an old board. The fine weave matters most on modern phones, where lead-free solder sits on tiny pads that lift if you hold heat too long, and faster wicking means shorter contact time, which protects pads, vias, and the small passives sitting next to your work area. On older boards with oxidized solder, a small dab of fresh flux on the pad before you lay the wick down makes the solder release much more willingly. In a real workshop flow, you reach for this wick right after you remove an IC with your hot air station, because the leftover solder bumps on the pads stop the new chip from sitting flat. A charging issue repair that needs a charging IC replacement, a dead phone that needs a fresh PMIC, or a network issue that traces back to an RF IC all follow the same pattern: lift the old chip, wick the pads flat and shiny, inspect under the microscope, then place and reflow the new part. The same applies before reballing work on CPU and eMMC chips in boot loop and hang on logo cases, where flat, clean pads decide whether your stencil sits evenly and your new balls form properly. Display problem jobs often come down to bridged connector pins after a careless repair, and a short pass with the 2.0 mm braid clears the bridge without touching the plastic housing of the connector. For best results, set your soldering station to the temperature your solder alloy needs, use a clean, well-tinned tip with a wide contact face, and hold the board steady in a PCB holder so your hand stays free for the wick. After cleaning, a quick check with your multimeter confirms that no hidden bridge remains between pads before you power the board. This wick sits inside the soldering consumables category at KB GSM Store, alongside flux, solder paste, and solder wire, and it pairs naturally with soldering stations, hot air stations, microscopes, reballing kits, and PCB holders that already live on your bench. When your work moves toward large ground planes, shield frames, or wide motherboard pads, the YCS 3520 wick with a 3.5 mm width makes a sensible next step, while the 2.0 mm YCS 2020 PLUS stays your everyday choice for IC-level precision. For repair shops in Lahore, Karachi, Islamabad, and every other city, keeping a 5-roll pack in stock means you never stop a paid job because the braid ran out, and the price in Pakistan stays friendly enough to treat the wick as a daily consumable rather than a tool you ration.