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Brand: YCS

YCS 2023-006 Desoldering Wick (5pcs Roll)

YCS 2023-006 Desoldering Wick (5pcs Roll)

Regular price Rs.1,500.00 PKR
Regular price Sale price Rs.1,500.00 PKR
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The YCS 2023-006 Desoldering Wick (5pcs Roll) gives your repair bench a dependable copper braid for removing old solder from mobile phone boards. Each roll is 2.0mm wide and 1.5m long. YCS weaves it from fine 0.06mm pure copper strands and fills the braid with rosin flux. It picks up solder quickly from charging connector pads, PMIC footprints, and CPU or eMMC lands after IC removal. The 2.0mm width fits the tight pad layouts on modern Android and iPhone logic boards. The five-roll pack keeps fresh wick ready for daily jobs in a busy Pakistani repair shop.

SKU:MST-SOLDERING-ACCESSORIES-681

⚖️ Weight: 0.01 kg

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Description

Every board-level job on a dead phone reaches the same point: the pads must be flat and clean before the new IC goes down. The YCS 2023-006 Desoldering Wick (5pcs Roll) handles that step on your repair bench. YCS braids this wick from 0.06mm pure copper strands into a 2.0mm wide band, and each roll holds 1.5m of usable length. Rosin flux sits inside the weave, so the braid wets quickly when your soldering iron tip touches it and pulls molten solder up by capillary action. You get flat, bright pads without scraping them with a blade or dragging a tip across delicate traces.
The 2.0mm width matters on mobile logic boards. Modern phones pack charging ICs, audio codecs, PMICs, and RF chips into very small footprints. A wide braid tends to touch nearby capacitors and resistors while you work. A 2.0mm band covers a WLCSP or QFN footprint in a few passes without spreading heat across the whole area. On larger lands, such as a CPU, eMMC, or UFS footprint after you lift the chip with a hot air station, you work in overlapping strokes. The fine 0.06mm strand weave also follows uneven pad surfaces closely, which helps you lift leftover solder balls that a thicker braid tends to miss.
In a normal workshop sequence, you remove the faulty IC with hot air, add a little fresh flux to the footprint, lay the wick flat on the pads, and press a clean iron tip on top. Let the solder flow into the braid, then lift the iron and the wick together so the copper does not stick to the board. Cut off the used, solder-filled section and move to fresh braid for the next pass. This routine prepares the board for reballing a BGA chip, fitting a new charging port, or seating a replacement PMIC when you chase a charging issue, a no-power fault, or a phone stuck on the logo after a hardware fault.
Temperature control decides how cleanly the wick performs. Lead-free solder on factory boards melts at a higher temperature than leaded rework alloy. Many technicians add a small amount of leaded solder to the pads first to lower the melting point, then wick everything off together. Set your iron to a working temperature that lets the braid flow within a second or two. Do not hold heat on one spot for long, because extended contact can lift pads or burn the solder mask. A chisel or knife tip transfers heat into the braid more evenly than a fine conical tip.
The YCS 2023-006 Desoldering Wick belongs in our solder consumables range, and it works best alongside the rest of your rework setup. Pair it with a temperature-controlled soldering station, a hot air station for IC removal, good no-clean flux, and a PCB holder that keeps the board steady while you work. A stereo microscope lets you confirm every pad is flat and free of bridges before you reball with a stencil from a reballing kit. For high-volume through-hole work, a dedicated desoldering station makes a natural upgrade, while this braid stays your main tool for surface-mount pad cleaning.
The five-roll pack suits shops that open a fresh roll every few days. Keep unused rolls sealed in their packaging so the flux stays active and the copper does not oxidise, and keep the open roll away from humidity on the bench. Technicians who replace charging ports, display connectors, and power ICs every day get a steady supply of braid from one purchase. Shop owners in Lahore, Karachi, and Islamabad who stock consumables in bulk get the same width and weave on every roll, which keeps results predictable for every technician on the team.

Key Features

  • 2.0mm braid width for tight mobile IC footprints
  • 1.5m usable length on each roll
  • Fine 0.06mm pure copper strand weave
  • Rosin flux inside the braid for fast solder pickup
  • Strong capillary absorption with low residue on pads
  • Good thermal conductivity for quick wetting under the iron tip
  • Leaves bright, flat pads ready for reballing or new IC placement
  • Pack of 5 rolls for daily workshop use

Specifications

Brand Entity YCS
Product Entity YCS 2023-006 Desoldering Wick (5pcs Roll)
Technology Entity Rosin flux-cored pure copper desoldering braid
Compatible Device Entities Smartphone and tablet logic boards, SMD/QFN/WLCSP/BGA footprints
Repair Process Entity Pad cleaning, IC removal, BGA reballing preparation, SMD rework
Industry Entity Mobile phone repair, PCB repair

Compatible Devices

  • Universal — not device-specific
  • Android and iPhone logic boards, tablets, and other compact PCBs
  • SMD pads, QFN, WLCSP, and BGA footprints
  • Standard soldering irons and temperature-controlled soldering stations

Common Repair Uses

  • Cleaning CPU, eMMC, and UFS pads after chip removal before reballing
  • Removing old solder from charging IC and PMIC footprints
  • Clearing solder from charging port and FPC connector pads
  • Removing solder bridges between fine-pitch IC pins
  • Preparing pads before jumper wire work on damaged traces
  • Cleaning shield frame pads after shield removal

FAQ

What is the product name?
The product name is YCS 2023-006 Desoldering Wick (5pcs Roll).
What is the brand of this product?
The brand of this product is YCS.
What is the model of this product?
The model of this product is 2023-006.
What is this product used for?
This product is used for removing solder from PCB pads, IC footprints, and connector pads during mobile phone board repair.
Which devices are compatible with this product?
This product is compatible with any PCB rework job; it is universal and not device-specific, and it suits smartphone and tablet logic boards.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
What are the width, length, and strand size of the YCS 2023-006 wick?
Each roll is 2.0mm wide and 1.5m long, woven from 0.06mm pure copper strands, which suits small mobile IC footprints.
Can I use the YCS 2023-006 desoldering wick to clean BGA pads before reballing?
Yes. After you remove the CPU, eMMC, or UFS chip with hot air, add flux, lay the braid flat, and stroke across the pads to leave them flat and ready for a reballing stencil.
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B
Bilal Ahmed
Authentic Product

Received the product in excellent condition. Original quality and very useful for professional mobile repair work.