YCS 4-in-1 Curved Air Gun Nozzle Set – 5mm/10mm/12x17mm/13x13mm for YCS R1 Series Hot Air Station

Every GSM technician running a YCS R1 series hot air station eventually deals with the same problem: the stock nozzle that ships with the machine is fine for general reflow, but it's not always the right shape for the chip sitting in front of you. This YCS 4-in-1 curved nozzle set solves that by giving you four nozzle sizes — 5mm, 10mm, 12×17mm, and 13×13mm — so you can match nozzle geometry to chip size instead of forcing one nozzle to do every job.
The curved design is the part that actually matters on the bench. A straight nozzle pushes air down in a column that scatters heat around the edges of a chip, which wastes airflow and pushes nearby components on a crowded board toward thermal stress they don't need. The curved, unobstructed shape on this set channels air through a smoother path, so it lands more directly on the BGA pads or IC footprint you're targeting. On dense boards — think iPhone logic boards or Samsung PMIC areas — that kind of control is the difference between a clean chip lift and a scorched pad.
Size matching is where this set earns its keep. The 5mm nozzle is built for small ICs — power management chips, audio ICs, charging ICs — where you want heat concentrated on a tight footprint without touching neighboring components. Move up to the 10mm nozzle for mid-size chips like NAND, baseband, or WiFi modules. The 12×17mm rectangular nozzle covers CPU and larger BGA packages where you need even heat across a wider surface, and the 13×13mm nozzle handles square chip footprints like RAM and combo ICs cleanly. Instead of running one nozzle at reduced airflow to avoid overheating small components, or running a small nozzle too long to fully lift a large chip, you pick the nozzle built for that job and get the reflow or desoldering done in the time it should take.
Mounting is quick-mount, matching the socket design on YCS R1, R1 Pro, and R1 Ultra hot air guns. There's no threading or fiddly alignment — you pull the hot nozzle off (once it's cooled or with the gun's sleep mode active), seat the next one, and get back to the board. On a busy repair bench in Lahore or Karachi where you might be jumping between three or four different phone models in an hour, that kind of quick swap matters more than it sounds like on paper.
This set is aimed at the actual failure patterns technicians deal with every day: dead phone diagnosis that traces back to a lifted or cracked BGA ball, board-level charging issue repair that needs a PMIC reflow, boot loop cases caused by a failing NAND that needs desoldering for reballing, and general IC change karna work across Android and iOS boards. Whether you're doing jumper lagana on a damaged trace near a chip or a full software marna and hardware fix combo after chip-level repair, having the right nozzle shape on hand keeps your airflow controlled and your success rate consistent.
For service centers and repair shop owners scaling up bench capacity, this nozzle set is a low-cost way to extend what your existing YCS R1 series station can actually do without buying a second machine. One station with all four nozzles on hand covers small IC rework through full CPU-level BGA jobs, which keeps your workflow moving whether the job on your bench is a Vivo charging IC or a Tecno board needing a NAND swap.
Keep the nozzles clean between jobs — flux residue building up inside the curved channel changes airflow behavior over time — and store them somewhere they won't get dented, since a bent nozzle mouth throws off the even heat distribution that makes this set worth using in the first place.