Skip to product information
1 of 4
Brand: YCS

YCS 55G White Soldering Flux

YCS 55G White Soldering Flux

Regular price Rs.550.00 PKR
Regular price Sale price Rs.550.00 PKR
Sale Sold out
Shipping calculated at checkout.
Quantity

YCS 55G White Soldering Flux is a rosin-based flux paste built for daily mobile phone board repair. It lowers solder surface tension so the alloy spreads evenly, wets pads properly, and forms bright, solid joints instead of dry or cold ones. The white paste stays easy to see under a microscope, works with lead-free solder, and stays non-conductive on dense smartphone motherboards. Use it for IC removal, BGA reballing, jumper work, charging port repair, and pad cleaning. The 55g tin gives a busy repair shop a long-lasting supply for every soldering and rework job on the bench.

SKU:MST-SOLDERING-ACCESSORIES-654

⚖️ Weight: 0.05 kg

  • Safe & Secure Payment
  • Fast Delivery
  • WhatsApp Support
View full details

Description

YCS 55G White Soldering Flux gives your repair bench a dependable rosin flux paste for the everyday soldering work that keeps a mobile repair shop running. Every technician knows the moment: you lift a charging IC with hot air, the pads look dull, and fresh solder refuses to flow because oxidation has taken over the copper. A good flux paste fixes that problem before it costs you a board. This YCS rosin paste reduces the surface tension of molten solder, so the alloy spreads evenly across pads, wets the joint properly, and forms a bright, solid connection instead of a dry or cold joint. The white formula sits cleanly on the board, which helps you see exactly where you applied it under a microscope when you work around tiny passive components or fine-pitch IC pins. The 55g tin holds enough paste for weeks of heavy daily use, and the wide opening lets you pick up the exact amount you need with a brush, a toothpick, or the tip of your tweezers. Flux plays a central role in nearly every stage of board-level repair. During IC removal, a thin layer under the hot air nozzle helps heat travel evenly across the chip body, so the solder underneath melts together and the component lifts without ripping pads. During reballing, the paste holds BGA solder balls in place on the chip and helps them settle into round, uniform shapes when you reheat. During jumper work, a small dab on the trace end lets the wire tin quickly so your bridge holds firm. When you rebuild a damaged charging port, replace a PMIC on a dead phone, swap an audio IC, or rework a CPU or eMMC/UFS memory chip, the same tin of flux supports every step from cleaning old solder to seating the new part. YCS describes this rosin flux as non-conductive, which matters on dense smartphone motherboards where neighbouring pads sit fractions of a millimetre apart. A quick wipe with isopropyl alcohol after major rework still pays off, because clean boards make inspection easier and stop sticky residue from collecting dust over time. The paste works with lead-free solder, which suits the solder wire and solder paste most Pakistani technicians use on modern Samsung, Oppo, Vivo, Infinix, Tecno, Xiaomi, and iPhone boards. Think about how flux fits into your full workflow. A hot air station handles chip removal, a soldering station takes care of pad cleaning and point soldering, a microscope gives you visibility, and a PCB holder keeps the board steady. Flux connects all of these tools, because without it heat transfer drops, solder balls up, and pads lift. Pair this YCS paste with a quality desoldering wick and you can clear old solder from pads in one smooth pass, leaving a flat surface ready for a new IC or a reballing kit stencil. When a customer brings a phone with a charging issue, a boot loop, a handset that hangs on logo after a fall, or a network issue from a cracked RF joint, the repair often comes down to reflowing or replacing a component, and that job always starts with flux. Technicians who handle software-side jobs with ISP pinout tools, eMMC programmers, UFS adapters, or test boxes also rely on flux when they solder thin wires to ISP points or reattach a memory chip after off-board programming. Apply the paste sparingly, since a thin coat gives better results than a heavy blob that traps heat and leaves extra residue. Keep the lid closed between jobs so the paste stays clean and free of metal dust from your bench. Shop owners and training institutes across Lahore, Karachi, Islamabad, and the rest of Pakistan keep consumables like this in steady stock because flux runs out fast in a busy workshop. KB GSM Store supplies YCS 55G White Soldering Flux for technicians who want consistent solder flow on every job, from a simple charging connector change to full BGA rework, so you spend less time fighting oxidized pads and more time returning repaired phones to your customers.

Key Features

  • Rosin-based flux paste that reduces solder surface tension for smooth, even flow across pads
  • White colour stays clearly visible under a microscope during fine-pitch work
  • Non-conductive formula suited to dense smartphone motherboards
  • Works with lead-free solder wire and solder paste
  • Improves wetting to produce bright, solid joints and prevent dry or cold soldering
  • Supports even heat transfer during hot air IC removal and rework
  • 55g tin gives a long-lasting supply for high-volume repair shops
  • Wide-mouth container allows easy pickup with a brush, toothpick, or tweezers

Specifications

Brand Entity YCS
Product Entity YCS 55G White Soldering Flux (rosin flux paste)
Technology Entity Rosin-based soldering flux, lead-free soldering, anti-oxidation wetting
Compatible Device Entities Smartphone motherboards (Samsung, Oppo, Vivo, Infinix, Tecno, Xiaomi, iPhone), PCB assemblies, BGA ICs
Repair Process Entity IC removal, BGA reballing, jumper wiring, pad cleaning, hot air rework, point soldering
Industry Entity Mobile phone repair, PCB repair, GSM hardware servicing

Compatible Devices

  • Universal — not device-specific; suitable for any mobile phone or tablet PCB
  • Android smartphone boards including Samsung, Oppo, Vivo, Infinix, Tecno, and Xiaomi
  • iPhone logic boards
  • BGA chips, PMICs, CPUs, eMMC and UFS memory ICs
  • General electronics PCBs using lead-free or leaded solder

Common Repair Uses

  • IC removal and replacement with a hot air station
  • BGA chip reballing for CPU, eMMC, UFS, and PMIC rework
  • Charging port and connector soldering
  • Pad cleaning with desoldering wick before installing a new component
  • Jumper wire installation on broken traces
  • Soldering wires to ISP points for programming and data recovery
  • Reflowing cracked joints behind charging, network, and display faults

FAQ

What is the product name?
The product name is YCS 55G White Soldering Flux.
What is the brand of this product?
The brand of this product is YCS.
What is the model of this product?
The model of this product is YCS 55G White.
What is this product used for?
This product is used for soldering, desoldering, IC rework, BGA reballing, and pad cleaning on mobile phone and electronic PCBs.
Which devices are compatible with this product?
This product is compatible with all mobile phone and tablet PCBs, including Android and iPhone boards, as it is a universal soldering consumable.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does YCS 55G White Soldering Flux work with lead-free solder?
Yes. This YCS rosin flux paste works with lead-free solder, which most modern smartphone boards and repair solder wires use.
Is this flux safe to use near small components on a dense motherboard?
Yes. YCS lists this rosin flux as non-conductive, so it suits tightly packed smartphone boards. Cleaning the area with isopropyl alcohol after heavy rework still gives the best inspection results.
Can I use this flux for BGA reballing?
Yes. The paste holds solder balls in place on the chip and helps them form uniform shapes during reheating.