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Brand: YCS

YCS Chip Seam Sealing Waterproof Black Adhesive 10CC

YCS Chip Seam Sealing Waterproof Black Adhesive 10CC

Regular price Rs.600.00 PKR
Regular price Sale price Rs.600.00 PKR
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The YCS Chip Seam Sealing Waterproof Black Adhesive 10CC helps you lock the edge of a CPU, NAND, eMMC, or power IC to the motherboard after reballing or chip replacement. It fills the seam around the chip body, keeps moisture and dust away from the solder balls, and protects the joints from the flex stress that brings phones back with a dead phone or boot loop issue. The black finish matches most motherboards and gives your work a neat, factory-style look. The 10CC syringe gives you controlled, thin beads with minimal waste, making it a smart everyday consumable for Pakistani repair shops and service centers.

SKU:MST-SOLDERING-ACCESSORIES-738

⚖️ Weight: 0.01 kg

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Description

The YCS Chip Seam Sealing Waterproof Black Adhesive 10CC gives you a clean way to lock the edge of a chip to the motherboard after board-level work, so moisture, dust, and flexing stress stay away from the solder balls underneath. Every technician knows the pain of a phone that comes back to the counter two weeks after a CPU or NAND job with the same dead phone symptom, and very often the cause is a cracked joint under a chip that nobody protected after reballing. This black seam sealant fills the gap around the chip body, bonds the edge to the PCB, and leaves a dark finish that matches most motherboards instead of a shiny smear that looks like a rushed repair. The 10CC syringe pack lets you push a thin, controlled bead exactly where you need it, and you avoid wasting material on a job that only needs a few drops. On the repair bench, this adhesive belongs at the very end of the IC workflow. You remove the faulty chip with your hot air station, clean the pads, reball or fit a new IC, and confirm the phone boots and charges properly. Only after the phone passes your testing do you seal the chip seam, because once the adhesive cures, removing that chip again takes far more effort. Run a fine bead along the edges of the CPU, eMMC, UFS storage, power IC, or display IC, let the material settle into the edge gap, and wipe any excess away from nearby small components and test points before it sets. Follow the curing method printed on the pack, and give the bead full cure time before you close the housing. That habit alone saves you from returns caused by boot loop issues, hang on logo faults, and random restarts that start after the customer drops the phone once. Black colour matters more than most buyers think. Customers in Pakistani markets often open phones at another shop or show the board to a friend, and a neat black seal around the IC reads as professional work rather than an amateur fix. It also hides small residue shadows around the chip edge and keeps the board looking uniform under your microscope when you photograph the job for a customer or for your shop’s page. For repair shops that handle water-damaged phones every day, the waterproof seal adds a second line of protection around the chips you already worked on, which helps when that same customer brings the phone back after another splash. The adhesive works alongside your hot air station, soldering station, reballing kits, stencils, and PCB holders, and you inspect the finished bead under a microscope to confirm even coverage with no gaps. Keep a multimeter nearby to check the lines before sealing, because a hidden short under a chip becomes much harder to fix once you lock the edge. If you handle storage chip work with eMMC programmers or UFS adapters, seal the chip only after the data job finishes and the phone boots normally, never before. Shop owners who move to full underfill work later can treat this edge sealant as the everyday step and keep underfill for high-value CPU jobs where the space under the chip needs complete filling. A few practical habits keep your results consistent. Store the syringe capped and away from direct sunlight and heat so the material stays usable for longer. Clean the board with isopropyl alcohol before sealing, because flux residue weakens the bond. Never cover connectors, shield contact points, or camera and antenna contacts, and keep the bead off components you might need to change later. Practice the bead on a scrap board first if you are new to chip sealing, since a steady hand and a slow push give a cleaner seam than a heavy line. For technicians across Lahore, Karachi, Islamabad, and every smaller city market who want a dependable chip seam sealant at a sensible price in Pakistan, the YCS Chip Seam Sealing Waterproof Black Adhesive 10CC is a practical consumable to keep in the drawer next to your flux and solder paste. You get neater boards, fewer comebacks on IC jobs, and a finish your customers notice. Order it from KB GSM Store with your other repair consumables and keep your bench stocked for every reballing and chip replacement job.

Key Features

  • eals the seam between the chip body and the motherboard
  • Waterproof protection around repaired IC edges
  • Helps protect solder joints from moisture, dust, and flex stress
  • Black colour blends with most mobile motherboards
  • 10CC syringe for precise, low-waste application
  • Suits CPU, NAND, eMMC, UFS, power IC, and display IC sealing
  • Gives repaired boards a neat, professional finish
  • Everyday consumable for reballing and chip replacement jobs

Specifications

Brand Entity YCS
Product Entity YCS Chip Seam Sealing Waterproof Black Adhesive 10CC
Technology Entity Chip edge sealing adhesive for BGA and IC components
Compatible Device Entities Smartphone and tablet motherboards with BGA chips (CPU, NAND, eMMC, UFS, PMIC, display IC)
Repair Process Entity Chip seam sealing after reballing and IC replacement
Industry Entity Mobile phone board-level repair and PCB repair

Compatible Devices

  • Universal — not device-specific
  • Smartphone and tablet motherboards carrying BGA-packaged chips
  • CPU, NAND, eMMC, UFS, PMIC, and display IC packages

Common Repair Uses

  • Sealing CPU edges after reballing or CPU replacement
  • Sealing NAND, eMMC, and UFS chips after storage IC replacement
  • Protecting power IC and charging IC joints after rework
  • Sealing display IC edges after screen IC repair
  • Adding moisture protection around reworked chips on water-damaged boards
  • Reducing comebacks from cracked BGA joints after drops

FAQ

What is the product name?
The product name is YCS Chip Seam Sealing Waterproof Black Adhesive 10CC.
What is the brand of this product?
The brand of this product is YCS.
What is the model of this product?
The model of this product is Chip Seam Sealing Waterproof Black Adhesive 10CC.
What is this product used for?
This product is used for sealing the seam around chips on mobile motherboards after reballing or IC replacement to protect the solder joints from moisture, dust, and stress.
Which devices are compatible with this product?
This product is compatible with smartphone and tablet motherboards carrying BGA chips such as CPU, NAND, eMMC, UFS, power ICs, and display ICs. It is not device-specific.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Should I seal the chip before or after testing the phone?
Always test first. Confirm the phone boots, charges, and works normally, then seal the chip seam, because removing a sealed chip later takes much more effort.
Can I seal a chip right after flux cleaning without drying the board?
No. Clean the area with isopropyl alcohol and let it dry fully before applying the adhesive, because leftover flux or liquid weakens the bond and leaves gaps in the seal.