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Brand: YCS

YCS iPhone X Series Motherboard Tester Socket

YCS iPhone X Series Motherboard Tester Socket

Regular price Rs.24,000.00 PKR
Regular price Sale price Rs.24,000.00 PKR
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The YCS iPhone X Series Motherboard Tester Socket is a 3-in-1 middle layer test fixture built for iPhone X, XS, and XS Max logic boards. After you separate the motherboard layers, this socket lets you power on the board and check core functions without soldering the flex cables back. Beryllium copper spring probes with a conical tip design give stable contact and resist rosin buildup, so your test data stays accurate through repeated use. The emerald aluminum alloy body includes a quick-release clamp for fast board swaps on a busy repair bench. Built for technicians running board-level diagnostics, IC reballing checks, and post-repair verification on dead or boot loop iPhone X series units.

SKU:MST-SOCKET-19

⚖️ Weight: 0.3 kg

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Description

When an iPhone X, XS, or XS Max comes in dead after flash or stuck on logo, the real diagnosis starts once you separate the motherboard layers. Testing the board loose, without soldering every flex cable back, is where the YCS iPhone X Series Motherboard Tester Socket earns its place on your bench. This 3-in-1 fixture holds the middle layer board and reconnects it to power, display, and function pins through spring-loaded probes, so you get live readings without a single solder joint.The probe system uses imported beryllium copper, a material technicians pick for board test tools because it holds conductivity under repeated pressure cycles without losing spring tension. Each probe has a conical tip, which keeps rosin and solder residue from building up on the contact point. On older test sockets you have probably seen tips clog after a few dozen uses, throwing off continuity checks. The conical design on this socket keeps that contact point self-cleaning as it presses in and out, so your test results stay consistent even after heavy daily use.Alignment is where a lot of cheaper test frames fall apart. This socket uses dual-ended precision alignment, meaning the probes line up with the board's small test holes from both directions. Combined with the snap-on clamp, the motherboard sits flat under even pressure across the whole surface. A tilted board during testing gives you false negatives on charging issues, display problems, or camera faults, so this flat-seating design directly protects the accuracy of your diagnosis.Housing is an emerald-colored aluminum alloy case, which is both a durability choice and a workflow choice. Aluminum resists the heat and flux exposure that a repair bench sees daily, while the quick-release mechanism lets you pop one board out and clamp the next in seconds. On a shop handling multiple iPhone X series units a day, that turnaround time on the socket itself adds up.In actual repair use, this tool covers the middle layer testing stage after board separation for iPhone X, XS, and XS Max. You use it to check if a board powers on after IC change karna, to confirm display and touch response are alive before you reassemble, and to catch hardware fault versus software marna cases early. If a board still shows dead after flash even after reflashing, testing it on this socket tells you within seconds whether the fault sits at the CPU, power IC, or a specific function line, instead of spending an hour reassembling the phone just to find out the fault is still there.This fixture fits directly into ISP and eMMC repair workflows too. Many shops running dead phone diagnostics through ISP pinout tools also need a quick way to confirm the board itself responds to power before pulling out the reballing kit or hot air station for a full IC removal job. Using the socket first narrows down whether you are dealing with a board-level short, a corroded connector, or a genuine IC failure, saving reballing and reflow time on boards that do not need it.For Pakistani repair shops working high volumes of iPhone X series boot loop, FRP lock, and dead after flash cases, this socket removes the guesswork of solder-and-test cycles. It gives you a repeatable, solder-free way to confirm board health at the middle layer stage, right on your repair bench.

Key Features

3-in-1 design covers iPhone X, XS, and XS Max middle layer boards in one fixture

Imported beryllium copper spring probes for stable, high-conductivity contact

Conical probe tip resists rosin and solder buildup, keeping contact points clean

Dual-ended precision alignment for accurate pin-to-pin connection

Snap-on clamp design keeps the board flat and stable during testing

Emerald-colored aluminum alloy housing resists heat and flux exposure

Quick-release mechanism for fast board swaps between jobs

Solder-free testing removes the need to reattach flex cables for diagnosis

Specifications

Brand Entity YCS
Product Entity Motherboard Middle Layer Test Fixture / iSocket
Technology Entity Beryllium Copper Spring Probe, Conical Probe Contact System
Compatible Device Entities iPhone X, iPhone XS, iPhone XS Max
Repair Process Entity Board-Level Diagnostics, Post-Separation Motherboard Testing
Industry Entity Mobile Repair Tools, PCB Repair Equipment

Compatible Devices

iPhone X, iPhone XS, iPhone XS Max motherboards (middle layer, post-separation testing)

Common Repair Uses

Motherboard function testing after layer separation, dead board diagnosis, power-on and boot verification, display and touch function checks, board-level fault isolation before IC reballing or reflow, post-repair verification after CPU or power IC rework

FAQ

What is the product name?
The product name is YCS iPhone X Series Motherboard Tester Socket.
What is the brand of this product?
The brand of this product is YCS.
What is the model of this product?
The model is the YCS iSocket 3-in-1 Motherboard Middle Layer Test Fixture.
What is this product used for?
This product is used for testing iPhone X series motherboards at the middle layer stage without soldering flex cables back.
Which devices are compatible with this product?
This product is compatible with iPhone X, XS, and XS Max motherboards.
Who should use this product?
This product is suitable for mobile repair technicians, GSM software technicians, repair shops, and service centers.
Does this socket support solder-free testing after board separation?
Yes, the spring probe design lets you power on and test the board directly without soldering flex cables back.
Why does this socket use a conical probe tip instead of a flat tip?
The conical tip resists rosin and solder residue buildup, keeping contact points clean for consistent test readings over repeated use.

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