Glue removal decides how clean every CPU or IC job ends, and the YCS-JGB Golden Cudgel Tool Set gives your repair bench a dedicated kit for that exact stage of the work. YCS packs two gold handles, six precision blades, and two cleaning brushes into one compact case, so you stop hunting for loose scalpels and worn brushes in the middle of a board repair. The kit targets the slow, delicate tasks that technicians face daily: scraping underfill adhesive around a CPU, lifting black glue from IC edges, removing old adhesive from a back glass housing, and cleaning pads after you pull a chip with hot air. When a dead phone lands on your counter and the fault traces to a damaged PMIC or a lifted CPU, you need to clear the glue before heat and flux can do their job properly. A sharp, stable blade lets you work around the chip perimeter without gouging the solder mask or tearing nearby traces, and that control matters most on tightly packed motherboards from iPhone, Samsung, Oppo, Vivo, Infinix, and Tecno. The handles use a cross-shaped chuck that locks each blade in a precise position, and the anti-slip mesh grip keeps your fingers steady during long scraping sessions under a microscope. Loose blades cause slips, and slips cause broken pads, so a firm clamp directly protects the board you are working on. Six blades in the set mean you always have a fresh, sharp edge ready when one dulls from hard epoxy, which keeps your cuts clean on underfill lines and lets you cut a damaged circuit trace neatly before you run a jumper wire. The two brushes handle the cleanup that follows every rework step. After you lift an IC with your hot air station, the pads carry burnt flux, glue crumbs, and leftover solder; a stiff brush with a little PCB cleaner clears that residue so you can inspect the pads and prepare them for reballing. Clean pads also make your multimeter readings more reliable when you check for shorts on a power line, because residue can hide a lifted pad or a bridged ball. In the typical Pakistani repair workflow, this kit sits between diagnosis and soldering. You first confirm the hardware fault with a test box or multimeter, mount the board in a PCB holder, soften the adhesive with controlled heat, and then use the YCS-JGB blades to clear underfill before you remove the chip. After removal, the brushes clean the area, and your reballing kit and soldering station take over for reinstallation. Technicians who handle storage chip swaps follow the same path, since eMMC and UFS chips also sit under underfill on many modern boards; clean pads give your eMMC programmer or UFS adapter a better chance at a stable read after rework, and the same care helps when you expose ISP pinout points for direct data access on a dead board. Back glass repair benefits from the kit as well. When a customer brings in a phone with a shattered rear panel, you need to strip the old adhesive from the frame before fitting new glass, and a sharp blade does that faster and cleaner than a generic cutter. The compact case measures about 132 × 82 × 15 mm and keeps all ten pieces organized, so the kit fits in a drawer, a field bag, or a crowded workbench without taking space from your microscope or hot air station. The whole set weighs around 60 g, which keeps the handles light in your hand during detailed work. For new technicians, the kit offers an affordable entry into proper CPU and IC preparation without buying blades and brushes separately. For experienced shop owners and service centers, it delivers a reliable daily tool that covers glue removal, CPU delamination, chip disassembly, circuit cutting, and PCB IC cleaning in one set. Order the YCS-JGB Golden Cudgel Tool Set from KB GSM Store and add a dedicated glue removal and cleaning kit to your repair bench, ready for workshops in Lahore, Karachi, Islamabad, and across Pakistan.
