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Brand: YCS

YCS Blade Tips Full Set (9Pcs/Set)

YCS Blade Tips Full Set (9Pcs/Set)

Regular price Rs.1,200.00 PKR
Regular price Sale price Rs.1,200.00 PKR
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The YCS Blade Tips Full Set (9Pcs/Set) gives mobile repair technicians nine hand-polished replacement blades in three sizes for CPU, NAND, and IC glue removal. Use the smaller edges to cut side underfill around tight chips and the wider edges to clean pads after chip removal. These blades fit naturally into board-level workflows such as IC change, reballing, and eMMC/UFS chip lifting for programming. With nine pieces in one pack, you always have a sharp edge ready on your repair bench, so you avoid slipping with a dull blade and damaging pads or traces on expensive motherboards.

SKU:MST-SOLDERING-ACCESSORIES-662

⚖️ Weight: 0.01 kg

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Description

Underfill glue often decides how a board-level job ends, and the YCS Maintenance Home Blade 3 Size Blade (9PCS) gives you three blade sizes to handle it at every stage of the work. When a phone lands on your bench as a dead phone, stuck in a boot loop, or hanging on logo after a failed flash, the fault often sits under a CPU, NAND, or eMMC chip that the manufacturer sealed with hard epoxy. Before you heat that chip with your hot air station, you need to cut the side glue, open a clean entry point, and lift the IC without tearing pads. This pack carries nine hand-polished blades in three sizes, so you always have a fresh, sharp edge for the specific gap in front of you instead of forcing one generic scalpel into every situation. YCS builds these blades for chip removal and glue cleaning on mobile phone motherboards, and that focus shows under the microscope. A narrower edge slips into the tight channel between a chip and nearby capacitors, while a broader edge clears residue from the pad area once the chip comes off. Matching the edge size to the job protects solder mask, keeps traces intact, and stops a simple IC change from turning into a jumper job. A typical workflow on a Samsung, Oppo, Vivo, Infinix, Tecno, or iPhone board starts with mounting the board on PCB holders, softening the underfill with controlled heat, and then working the blade along each side of the chip. Once the CPU or NAND lifts, you switch to a wider edge, add flux, and level the pads with your soldering station and wick before you move to reballing kits and stencils. Clean pads decide whether the reballed chip seats correctly, so your scraping quality directly affects whether the phone boots or returns to your counter with the same hardware fault. The same blades help on lighter jobs too: lifting shields, freeing stuck flex connectors, removing old adhesive from mid-frames, and scraping residue around charging IC and PMIC areas when you trace a charging issue or a network issue. The pack contains blades only, so you pair them with a compatible handle such as the YCS 9G blade handle, which keeps your grip light and steady during long microscope sessions. Swapping a worn blade takes seconds, and nine pieces in one pack mean you never push a dull edge that slips and gouges the board. For technicians running software and hardware work side by side, this pack sits naturally beside ISP pinout tools, eMMC programmers, and UFS adapters. When a phone goes dead after flash and the ISP points sit under a glued area, you clear the glue first, solder your jumper wires next, and only then run the device through your test boxes. When you pull an eMMC or UFS chip for direct programming, these blades handle the glue and cleaning steps before and after the chip goes onto the programmer socket. Your microscopes show exactly where the edge sits, and your multimeters confirm that no line broke during scraping. Repair shops across Pakistan treat blades as consumables because every CPU job wears an edge down, and a technician working with a sharp blade finishes faster with fewer damaged pads. Training institutes use multi-size packs like this to teach students how blade size affects control, and service centers stock them to keep every bench at the same standard. If you are building or upgrading a board-level setup, start with the essentials: a reliable hot air station, a soldering station, a good microscope, PCB holders, and a pack of sharp blades. From there, move up to reballing kits and programming tools as your work expands into chip-level data recovery and IC replacement. The YCS Maintenance Home Blade 3 Size Blade (9PCS) earns its place at the start of that path because almost every chip-level repair begins with clean glue removal.

Key Features

  • Nine replacement blades in one pack, so you always keep a sharp spare on the bench
  • Three blade sizes to match narrow chip gaps and wider pad-cleaning areas
  • Hand-polished edges for clean, controlled cutting through hard underfill glue
  • Built for CPU, NAND, and IC chip removal on mobile phone motherboards
  • Helps clean solder pads after chip removal before reballing and re-soldering
  • Pairs with the YCS 9G blade handle for a light, steady grip under the microscope
  • Quick blade swaps keep long board-level sessions efficient
  • Handles lighter jobs such as shield lifting, flex connector release, and adhesive cleaning

Specifications

Brand Entity YCS (Maintenance Home)
Product Entity YCS Maintenance Home Blade 3 Size Blade (9PCS)
Technology Entity Hand-polished precision repair blades for glue and underfill removal
Compatible Device Entities Mobile phone motherboards (Android and iPhone), tablets, digital device circuit boards
Repair Process Entity CPU/NAND chip removal, underfill glue removal, pad cleaning, reballing preparation
Industry Entity Mobile phone repair, PCB repair, board-level electronics repair

Compatible Devices

  • Universal — not device-specific
  • Mobile phone motherboards, including Android and iPhone boards
  • Tablets and other digital device circuit boards
  • YCS 9G blade handle (handle sold separately)

Common Repair Uses

  • Cutting side underfill glue around CPU, NAND, and eMMC/UFS chips before removal
  • Prying and lifting glued chips after controlled hot air heating
  • Cleaning glue residue from solder pads before reballing
  • Exposing ISP points hidden under glue for dead phone and dead-after-flash repairs
  • Removing adhesive from mid-frames, shields, and stuck flex connectors
  • Scraping residue around charging and PMIC areas during fault tracing

FAQ

What is the product name?
The product name is YCS Maintenance Home Blade 3 Size Blade (9PCS).
What is the brand of this product?
The brand of this product is YCS (Maintenance Home).
What is the model of this product?
The model of this product is Maintenance Home Blade 3 Size Blade (9PCS).
What is this product used for?
This product is used for CPU, NAND, and IC chip removal, underfill glue removal, and solder pad cleaning on mobile phone motherboards.
Which devices are compatible with this product?
This product is compatible with mobile phone motherboards, tablets, and other digital device circuit boards; it is a universal tool and not device-specific.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Can these blades remove hard underfill glue from CPU and NAND chips?
Yes. YCS designs these blades for chip removal and glue cleaning on phone motherboards. Soften the underfill with controlled hot air first, then work the blade along each chip edge to avoid lifting pads.
Does the pack include a handle, and which handle fits these blades?
No, the pack contains nine blades only. You can pair them with the YCS 9G blade handle, which YCS offers for these blades.