Underfill glue often decides how a board-level job ends, and the YCS Maintenance Home Blade 3 Size Blade (9PCS) gives you three blade sizes to handle it at every stage of the work. When a phone lands on your bench as a dead phone, stuck in a boot loop, or hanging on logo after a failed flash, the fault often sits under a CPU, NAND, or eMMC chip that the manufacturer sealed with hard epoxy. Before you heat that chip with your hot air station, you need to cut the side glue, open a clean entry point, and lift the IC without tearing pads. This pack carries nine hand-polished blades in three sizes, so you always have a fresh, sharp edge for the specific gap in front of you instead of forcing one generic scalpel into every situation. YCS builds these blades for chip removal and glue cleaning on mobile phone motherboards, and that focus shows under the microscope. A narrower edge slips into the tight channel between a chip and nearby capacitors, while a broader edge clears residue from the pad area once the chip comes off. Matching the edge size to the job protects solder mask, keeps traces intact, and stops a simple IC change from turning into a jumper job. A typical workflow on a Samsung, Oppo, Vivo, Infinix, Tecno, or iPhone board starts with mounting the board on PCB holders, softening the underfill with controlled heat, and then working the blade along each side of the chip. Once the CPU or NAND lifts, you switch to a wider edge, add flux, and level the pads with your soldering station and wick before you move to reballing kits and stencils. Clean pads decide whether the reballed chip seats correctly, so your scraping quality directly affects whether the phone boots or returns to your counter with the same hardware fault. The same blades help on lighter jobs too: lifting shields, freeing stuck flex connectors, removing old adhesive from mid-frames, and scraping residue around charging IC and PMIC areas when you trace a charging issue or a network issue. The pack contains blades only, so you pair them with a compatible handle such as the YCS 9G blade handle, which keeps your grip light and steady during long microscope sessions. Swapping a worn blade takes seconds, and nine pieces in one pack mean you never push a dull edge that slips and gouges the board. For technicians running software and hardware work side by side, this pack sits naturally beside ISP pinout tools, eMMC programmers, and UFS adapters. When a phone goes dead after flash and the ISP points sit under a glued area, you clear the glue first, solder your jumper wires next, and only then run the device through your test boxes. When you pull an eMMC or UFS chip for direct programming, these blades handle the glue and cleaning steps before and after the chip goes onto the programmer socket. Your microscopes show exactly where the edge sits, and your multimeters confirm that no line broke during scraping. Repair shops across Pakistan treat blades as consumables because every CPU job wears an edge down, and a technician working with a sharp blade finishes faster with fewer damaged pads. Training institutes use multi-size packs like this to teach students how blade size affects control, and service centers stock them to keep every bench at the same standard. If you are building or upgrading a board-level setup, start with the essentials: a reliable hot air station, a soldering station, a good microscope, PCB holders, and a pack of sharp blades. From there, move up to reballing kits and programming tools as your work expands into chip-level data recovery and IC replacement. The YCS Maintenance Home Blade 3 Size Blade (9PCS) earns its place at the start of that path because almost every chip-level repair begins with clean glue removal.