YCS Mr.Yang M.Y-005 Strong Magnetic Silicone Pad – Heat-Resistant Tin Planting Mat

Reballing a dead IC on a phone motherboard only goes smoothly when the tin planting stencil stays exactly where you put it. That's the entire point of the YCS Mr.Yang M.Y-005 — a magnetic silicone pad designed to hold your BGA steel mesh stencil steady while you plant tin balls on CPU, NAND, and other chip packages during board-level repair.
The pad ships with four separate slot sizes: 0.35mm, 0.45mm, 0.55mm, and 0.65mm. Different chips need different ball sizes depending on their pad pitch, so having all four slots on one mat means you're not swapping tools mid-job when you move from a small NAND chip to a larger CPU package. You place the steel mesh over the slot that matches your chip, drop your solder balls or paste on top, and run your hot air or reflow process.
What separates this pad from a plain silicone sheet is the magnetic layer underneath. Standard tin planting work on a loose mat often ends with the steel mesh drifting slightly during heating, which throws off ball alignment and leaves you reworking the same chip twice. The M.Y-005 pulls the mesh down with strong magnetic force, so it stays locked in position even through the heat cycle. That translates into cleaner, more even ball placement on the first attempt — something that matters when you're charging for a repair and can't afford a second round of reballing on the same board.
Heat management is built into the design rather than added as an afterthought. The back of the pad has dissipation holes that let heat escape during tinning instead of building up under the mesh. Without that venting, repeated heat exposure can cause the mesh to bulge or warp, which ruins the flatness you need for consistent ball height across the chip. The holes keep the surface stable job after job, so the pad holds its shape through regular workshop use rather than degrading after a few reballing sessions.
The silicone material itself is rated for high-temperature exposure, which is necessary given how close this pad sits to your hot air nozzle or reflow station during chip work. It resists bubbling and surface breakdown that cheaper mats develop after repeated heat cycles, so you're not replacing your tin planting pad every few weeks.
In a typical repair workflow, this pad sits between your board diagnosis stage and your final reflow step. Once you've identified a dead IC or a chip causing a hang on logo or boot loop issue and pulled it off the board, the M.Y-005 becomes your workstation for preparing the replacement chip before it goes back on. It fits naturally alongside your hot air station, BGA stencils, reballing kit, and microscope as part of a complete chip-level repair setup — the kind of bench most GSM and PCB repair technicians build over time.
For a repair shop handling motherboard-level faults regularly, a dedicated magnetic tin planting pad like this removes one of the more frustrating variables in reballing work: stencil movement during heating. Whether you're reballing a CPU on a dead-after-flash board or replacing a NAND chip on a unit with storage faults, having a mat that keeps your mesh locked in place saves rework time and gives you more consistent results across different chip sizes.