YCS Font/NAND Solder Mask Repair Green Oil UV Stencil – BGA Reballing Stencil

When you lift a NAND IC or power chip off a logic board, the green solder mask underneath almost always gets damaged. Skip rebuilding that mask and your next reballing attempt risks bridging, shorts, or a board that goes dead after flash. The YCS Font/NAND Solder Mask Repair Green Oil UV Stencil exists to fix exactly this problem on your repair bench.

This stencil is molded directly from real BGA chips at 1:1 scale, so the aperture pattern lines up with the actual pad layout instead of a generic grid. You place it over the chip side or PCB side pad area, apply green oil through the cut-outs, then cure it with a UV lamp. The hollowed design lets light pass through fast, so the oil sets in seconds instead of minutes, and you get back to reballing the chip without losing your workflow rhythm.

Stainless steel construction means this stencil survives repeated use. It resists bending when you scrape excess oil off the surface, and it cleans up with PCB water or alcohol between jobs without warping. One sheet supports multiple BGA pad sizes, including BGA200, BGA178, BGA315, BGA254, BGA297, BGA153, BGA221, BGA162, BGA110, BGA70, BGA60, and BGA169, so you're not buying separate stencils for every chip footprint you come across at the shop.

In a typical NAND repair job, you remove the damaged chip, clean the pads, and find the solder mask flaking or missing around the ball pattern. Without rebuilding it, the new chip you reball won't sit flat, and you'll likely get a board that boots into a hang on logo or stays a dead phone after the rework. Lay this stencil over the cleaned pad area, apply a thin, even coat of green oil with a scalpel, press the stencil down so the printed side faces the pads, then run your UV lamp over it for 6 to 15 seconds depending on oil thickness. Peel the stencil off and you've got a fresh, properly aligned insulation layer ready for the next reballing step.

This tool fits straight into your eMMC and UFS repair workflow, not just NAND work. Use it before reballing CPU, power IC, baseband, or WiFi chips on iPhone and Android boards alike — anywhere the chip footprint matches one of the supported BGA sizes. Technicians running a busy bench pair it with a UFS box, a hot air station for chip removal, and a digital microscope for pad inspection, making mask repair one more reliable step instead of a guessing game.

Software marna and IC change karna jobs go faster once mask repair stops being a bottleneck. You stop losing boards to bridged balls after reballing, and you stop re-doing the same chip twice because the mask wasn't rebuilt properly the first time. For a service center processing several boards a day, that's fewer comebacks and fewer wasted ICs.

Keep it in your reballing kit next to your stencils, BGA jigs, and PCB holder, and you'll have a faster, more consistent fix for damaged solder mask on almost any chip that lands on your bench.