YCS PPD Solder Paste 138

YCS PPD Solder Paste 138 gives your repair bench a low-melt option for the jobs where full-temperature heat puts a board at risk. Every technician in Pakistan knows the moment: a phone comes in with a hardware fault, the culprit sits under a BGA chip, and the neighbouring components, flex connectors, and plastic parts will not survive a long blast of hot air. This 50g YCS paste melts at 138°C, so you can reflow joints and plant fresh balls at a noticeably lower temperature than standard 183°C paste demands. That lower heat window protects nearby ICs, underfill, and multilayer PCB traces while you work, which matters most on thin modern motherboards where a single lifted pad turns a simple IC change into a jumper job. Technicians call this type of product PPD paste, and it sits at the heart of BGA reballing, CPU work, and general SMD rework on mobile phone boards. The paste holds a stable, viscous consistency that resists slump and keeps chip components from drifting before the solder melts, so your stencil prints stay clean and your balls form round and even. Its strong flux activity and anti-oxidation formula help it wet pads properly and create bright, full joints, which cuts down on cold joints and false welds that later return as a dead phone or an intermittent fault on the customer's next visit. In a typical reballing workflow, you lift the chip with a hot air station, clean old solder off the pads with a soldering station and wick, secure the chip or board in a PCB holder, apply YCS PPD Solder Paste 138 through a stencil from your reballing kit, and reflow at low temperature until every ball forms evenly. A microscope lets you confirm ball shape and spot bridges before the chip goes back on the board. This low-temperature approach suits stacked or sandwich-style motherboards, where you need to separate or rejoin board layers without overheating the components on the other side. It also helps when you replant a chip close to heat-sensitive parts such as camera connectors, display connectors, or tiny passive components that shift easily under high heat. Repair situations that lead you to this paste include a phone stuck in a boot loop or hang on logo due to a cracked BGA joint, a charging issue traced to a PMIC or charging IC, a network issue from an RF or baseband chip, and no-power faults where a CPU or memory chip needs rework. Storage chip work fits here too: when you reball an eMMC or UFS chip before reading or writing it through eMMC programmers, UFS adapters, or ISP pinout tools, clean and even balls make the difference between a stable connection and repeated read errors. After the job, a test box and a multimeter help you confirm current draw and continuity before you hand the phone back. The 50g container gives a busy workshop enough material for many jobs, and the compact size fits neatly into a tool drawer or reballing kit. Keep the lid tightly closed after every use so the flux does not dry out, stir the paste before application if it has sat unused for a while, and apply only the amount the stencil needs to avoid excess residue. Clean flux residue from the board after reflow with a suitable PCB cleaner so it does not attract moisture or dust over time. Pair this paste with the higher-temperature versions in the YCS range when a job calls for stronger mechanical joints, and keep the 138°C option ready for heat-sensitive situations. For technicians who open iPhone, Samsung, Oppo, Vivo, Infinix, and Tecno boards every day, a dependable low-melt paste saves rework time and reduces the risk of turning a repairable phone into a board-level loss. KB GSM Store stocks YCS PPD Solder Paste 138 for repair shops, service centres, and training institutes across Pakistan, including Lahore, Karachi, and Islamabad, so you can restock your bench without hunting through the market.