Every CPU or memory chip swap on a mobile motherboard starts with the same messy job: underfill glue sits around the chip, old solder clings to the pads, and the chip keeps sliding while your blade works across it. The YCS Universal Glue Removal Fixture Magnetic Platform solves that bench problem with a compact synthetic stone base that locks the chip in place through a magnetic clamping design, so you scrape glue and clear tin with steady hands instead of chasing a moving part across the mat. YCS builds this platform for degumming, detinning, and chip protection work, and the U-shaped layout keeps the chip seated while leaving the edges open for your blade, which matters when you clean black epoxy from a Qualcomm or MediaTek processor after a dead phone diagnosis points toward a CPU-level hardware fault. The synthetic stone body handles high temperature from your hot air station without warping, resists flux and solder corrosion, and wipes clean after each job, so the surface stays flat through daily workshop use. Anti-slip rubber feet hold the base firm on your repair bench, which helps when you apply blade pressure on stubborn glue around an Apple A-series CPU or a Samsung processor. The footprint measures 85 x 60 x 19 mm and the platform weighs roughly 97 grams, so it fits under most stereo microscopes without crowding your working area and moves easily between benches in a busy service center. In a typical Pakistani repair shop workflow, a phone arrives with a hang on logo complaint, a boot loop issue, or a dead after flash condition that software tools cannot recover, and your diagnosis leads to removing the CPU or memory chip. You lift the chip with hot air, place it on this fixture, scrape the underfill and old solder, then move straight to reballing with the matching stencil, and the same platform holds the chip during tin planting. That single base covers three stages of the chip rework process, which cuts tool switching and lowers the risk of cracking a fragile die or tearing a pad. Let the chip cool for a few seconds after removal before you start scraping, because slightly hardened underfill lifts away in clean strips under a sharp blade instead of smearing across the pads, and hold the blade at a low angle so you clear glue without digging into the solder mask. The fixture pairs naturally with YCS CPU reballing stencils for Apple A8 to A19 Pro, Qualcomm Snapdragon, MediaTek Dimensity, HiSilicon Kirin, and Samsung processors, which lets you build a complete CPU rework setup around one base. For a full chip-level bench, connect this platform with tools from our Reballing Kits, Hot Air Stations, Soldering Stations, Microscopes, and PCB Holders categories, and keep a reliable Multimeter close for short testing before and after rework. When the job moves toward memory recovery, the cleaned chip goes forward to eMMC Programmers or UFS Adapters for reading and writing, while boards that still carry their memory chip can go through ISP Pinout Tools and Test Boxes instead. Beginner technicians gain a safe, stable surface for learning glue removal without risking expensive processors, while experienced engineers get a faster routine for repeated CPU swaps across iPhone and Android boards built on Qualcomm, MediaTek, and Samsung chipsets. The magnetic design means you skip tape, clips, and improvised holders that shift under heat, and you keep both hands free for the blade and tweezers. Clean the stone surface with isopropyl alcohol after every job to stop flux residue from building up, and the platform stays ready for the next chip. KB GSM Store supplies the YCS Universal Glue Removal Fixture Magnetic Platform across Pakistan, including Lahore, Karachi, and Islamabad, for repair shops, service centers, and training institutes that want a dependable glue removal and reballing base on every bench.
