Amaoe MI17 Stencil: MediaTek CPU and Power IC Reballing for Redmi Note 12 Pro The Amaoe MI17 Stencil gives you a ready pattern for the MediaTek ICs on Redmi Note 12 Pro and Note 12 Pro+ boards. It carries a 0.12mm thickness and targets the Dimensity 810, 1100, and 1200 platforms, along with the power ICs that sit beside the CPU. When a phone lands on your bench as a dead phone, a charging issue, or a hang on logo case and you trace the hardware fault to a bad CPU or PMIC joint, you lift the chip, clean the pads, and reball it with this plate. The aperture layout already matches the IC footprint, so you stop guessing ball position by eye. In a busy Pakistani repair shop, that cuts minutes from every IC change karna job and keeps your results repeatable from one board to the next.Which MediaTek ICs the Amaoe MI17 Stencil Covers One stencil, many chips: that is the main reason technicians pick the MI17. The listing names the CPU codes MT6891Z, MT6893Z, MT6877V, and MT6833V. It also names the power and support ICs MT6315, MT6359, MT6365, MT6355XP, MT6190W, and MT6190MV, plus 58090, 77048E, VC7920-11, and RAM 556. Read the marking on your lifted chip and compare it with this list before you heat anything. That check takes ten seconds and saves you from a wrong stencil and a wasted pad cleaning. Redmi boards in the Note 11 and Note 12 range show up often in Pakistani shops, so this single plate earns its place fast. If your board carries a Qualcomm CPU, grab the matching Amaoe Qualcomm stencil from the same category instead.Reballing Workflow on Your Repair Bench Start by lifting the chip with your hot air station and a good flux. Pull leftover solder off the pads with braid, then clean the pads with IPA until they shine under your microscope. Fix the board in a PCB holder, set the Amaoe MI17 Stencil flat over the pads, and align every aperture with its pad before you do anything else. Spread solder paste or tin across the stencil, then heat gently with hot air until the balls form. Keep your paste fresh and your temperature steady, because rushed heat warps the stencil and smears the balls. Let the board cool, lift the stencil away, check each ball, then place the IC and reflow it. Pair the plate with a hot air station, a reballing kit, and a microscope. If you also reball iPhone boards, move up to an Amaoe planting tin platform with a magnetic base for faster alignment.Compatible Redmi and Poco Models and Common Faults The listing ties this stencil to Redmi Note 10, Note 10 Pro, Note 11, Note 11 Pro, Note 11 Pro+, Note 11E, Note 11SE, Note 11R, Note 12 Pro, Note 12 Pro+, Poco M3 Pro, Poco M4 Pro, and Poco X3 GT. Use it when the phone shows a boot loop issue, hang on logo, charging issue, network issue, or no power and your tests point to a lifted joint under the CPU or a power IC. Run your diagnosis first, because box chalana or software marna will not fix a hardware fault. Once you finish the reball, test the board before you close the phone, then flash the software if the repair needs it. Keep this stencil in your MTK drawer next to your other Amaoe MI series plates, so you pull the right one in seconds.