If you repair iPhone logic boards, the 2UUL BG01 ABCD Reballing Stencil for iPh 8-16PM (4pcs/pack) replaces a drawer full of single-purpose stencils with one organized set of four, and it covers every iPhone from the iPhone 8 up to the iPhone 16 Pro Max (the iPhone 16e is not included). Each stencil carries a letter that maps to a chip group on the board. Stencil A handles the CPU and NAND flash, stencil B handles the baseband IC and WiFi IC, stencil C handles RF ICs, power amplifier ICs and other small chips, and stencil D handles display, face recognition, docking board, infrared, True Tone and camera solder points. You pick the letter that matches the chip in front of you, and you skip the guesswork of hunting for the right template. The laser-cut holes in the 0.12mm plate let you align the stencil over the pads and print solder balls that come out uniform, which reduces the reflow attempts you burn on a single chip. A stencil like this earns its place in mobile repair because a bad ball array causes exactly the faults customers bring in: a phone that stays dead after a chip swap, a boot loop that returns after reassembly, a hang on logo that appears only when the board warms up, or a network issue that traces back to a baseband joint. When you reball a NAND or CPU after a hardware fault, clean pads and evenly sized balls decide whether the chip seats flat and makes contact on every pad. The stencil gives you that consistency without you cutting corners on the bench. Your workflow starts with removing the chip using a hot air station and a stable soldering station, then cleaning the old solder off the pads and the chip underside with flux and wick. Next, you seat the chip in a fixture or PCB holder, lay the matching stencil from the 2UUL BG01 ABCD set over it, and press solder paste or place balls through the holes. After that, you lift the stencil, heat the chip to form the balls, and inspect the result under a microscope before you place the chip back on the board. Because the set splits into four stencils by chip group, you can keep the letters you use most, such as A for CPU and NAND work, close to your hot air station while the rest stay in the pack. That grouping also helps a busy workshop, since one technician can hand a specific letter to another instead of hunting through mixed stencils on a shared bench. Technicians who move from software-side fixes, such as FRP lock removal, pattern unlock and flashing, into board-level repair find this kind of set a practical first step, because it covers many common iPhone chip positions without a separate purchase for each. If you already own a reballing kit, this pack extends it with iPhone-specific coverage, and if you use a multimeter or test box to trace a fault to a chip first, the stencils let you act on that diagnosis right away. Pair the set with a good flux, fresh solder balls or paste, a microscope for inspection and a stable hot air station, and you cover the full rework loop from removal to reflow. For repair shops in Lahore, Karachi, Islamabad and other cities where iPhone motherboard jobs come in daily, a single 4-in-1 pack keeps your consumables organized and your turnaround predictable. The set also suits training institutes that teach reballing, because students see the chip groups laid out by letter and learn to match stencil to component. Keep the plates flat, clean off flux residue after every use and store them in the pack so the holes stay sharp for the next job. Heat-resistant, durable construction means the stencils hold their shape through repeated reflow cycles, and stainless steel construction keeps the plate rigid enough to hold alignment while you work. Check the model of the board you are working on against the iPhone 8 to iPhone 16 Pro Max range before you start, and confirm that your specific chip position falls inside the A, B, C or D group. Buy the 2UUL BG01 ABCD Reballing Stencil for iPh 8-16PM (4pcs/pack) from KB GSM Store when you want one dependable set that supports the chip-level iPhone repairs your customers ask for most.
