2UUL BG02 Universal Reballing Stencil A&B (2pcs)

The 2UUL BG02 Universal Reballing Stencil A&B (2pcs) puts two steel stencil sheets in your hands that cover a wide spread of BGA pitches, so one pack handles most of the chips that reach your repair bench. Sheet A carries 0.3, 0.35, 0.375, 0.4, 0.5, 0.6 and 0.65 mm patterns, and sheet B carries 0.5, 0.55, 0.6, 0.62, 0.7, 0.8 and 0.85 mm patterns. That range lets you match the ball spacing of iPhone CPUs, NAND flash chips, WiFi ICs, baseband ICs, power management ICs and smaller support ICs without buying a separate stencil for every part number. Reballing starts after the chip leaves the board. You lift the IC with a hot air station, clean the pads and the chip underside with flux and desoldering wick on your soldering station, and then you need a template that lines every hole up with every pad. This stencil set sits at exactly that step of the BGA rework process. You identify the ball pitch of your chip, choose the matching hole pattern on sheet A or sheet B, align it over the pads under a microscope, and hold it flat with a PCB holder or a magnetic platform. Then you apply solder paste or drop balls, heat the chip gently, lift the stencil away, and check the finished ball grid before you place the chip back on the board. That workflow matters in the jobs Pakistani technicians face every day: a dead phone that draws no current after a fall, a boot loop issue that traces back to a cracked NAND joint, a hang on logo fault that survives every software reflash, a network issue caused by a lifted baseband ball, or a charging issue that points to a damaged power management IC. Each of these hardware fault cases ends at the same bench task, which is a clean and evenly spaced set of new balls under the chip. Each sheet measures 100 x 85 x 0.1 mm, and the steel construction gives you a thin template that keeps the holes close to the pads, which helps the balls settle where you want them. A universal two-sheet pack also cuts your cost per job. You reuse the same pair across dozens of chip models, so a busy workshop or service center spends less on consumables and keeps fewer single-chip stencils in the drawer. Check the ball pitch and the array layout of your chip before you start, because the stencil works by pitch matching, not by device name. If you repair iPhone boards, you can use the set for the pitch sizes that appear on the CPU, NAND, WiFi, baseband and power management chips you handle. If you work on Android boards, you can use it for any BGA chip whose pitch falls inside the 0.3 to 0.85 mm range. Pair the stencil with quality flux, solder balls or paste that suit your chip, a stable hot air station, and a microscope so you can confirm alignment before you heat. Keep the sheets flat and clean between jobs, wipe off flux residue after every reball, and store them away from bends so the hole pattern stays true. Technicians who separate the work into a clear sequence of chip removal, pad cleaning, stencil alignment, ball forming and final inspection see fewer bridged balls and fewer repeat visits. When you build out the rest of your rework setup, browse the Reballing Kits, Hot Air Stations, Soldering Stations, Microscopes and PCB Holders categories at KB GSM Store, and add Multimeters and Test Boxes for checking the board before and after the reball. If your repair also involves storage chips, look at the eMMC Programmers, UFS Adapters and ISP Pinout Tools categories, which cover the programming and data side of the same NAND and eMMC repair workflow. The 2UUL BG02 pack is a practical upgrade path for a technician who outgrew a single-pitch stencil and wants broad pitch coverage in one purchase, and it suits repair shop owners who train new staff on BGA rework because the A and B sheets make pitch selection easy to teach.