2UUL BH13 MidReball Base 5 in 1
2UUL BH13 MidReball Base 5 in 1
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The 2UUL BH13 MidReball Base 5 in 1 gives iPhone board repair technicians a magnetic mid-layer reballing platform for iPhone 12 to iPhone 16 Pro Max logic boards. You get one steel magnetic base, five positioning plates, and fifteen reballing stencils in a single compact set. Three large built-in magnets lock the mid-layer frame and stencil in place, so your solder paste and heat go exactly where you want them. Use it on dead phone, boot loop issue, and network issue repairs where the middle layer joints fail. Order the 2UUL BH13 from KB GSM Store and bring faster, cleaner reballing to your repair shop in Pakistan.
SKU:MST-SOLDERING-TOOLS-1072
⚖️ Weight: 0.65 kg
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Description
Mid-layer reballing on iPhone 12 through iPhone 16 Pro Max boards punishes any fixture that lets the board shift by even a fraction of a millimetre, and the 2UUL BH13 MidReball Base 5 in 1 removes that risk from your repair bench. The set gives you one steel magnetic base, five positioning plates, and fifteen reballing stencils, so you cover the mid-frame layer across the iPhone 12, 13, 14, 15, and 16 series without hunting for separate fixtures. Technicians in Pakistani repair shops see the same pattern again and again: a dropped or liquid-damaged sandwich board arrives as a dead phone, a boot loop issue, a hang on logo case, a charging issue, or a network issue, and the hardware fault traces back to weak solder joints on the middle layer. You fix those faults by separating the layers, cleaning the pads, and reballing the mid-layer with fresh solder, and this platform turns the reballing step into a repeatable process instead of a gamble. You seat the correct positioning plate on the magnetic base, lay the mid-layer frame on the plate, and set the matching stencil on top. Three large built-in magnets pin the stack in place, so the stencil stays flat while you spread solder paste and apply heat. The grooved design gives your tweezers room to grab the stencil edge, so you lift it away without smearing paste or dragging the fresh balls out of position. Manufacturers build the base from high-quality steel that resists wear, and the high-temperature-resistant construction survives repeated reflow cycles on a busy workshop bench. The platform measures 130 x 84 x 11 mm and weighs 356.5 grams net, so it fits under your microscope with room left for your hot air nozzle. Beginners follow the simple soldering process without long practice, and experienced microsolderers save time because they stop re-aligning stencils by hand on every board. The BH13 sits in the middle of your board repair workflow. You check the rails with a multimeter, lock the board in a PCB holder, and separate the layers with your hot air station. You inspect the pads under a microscope, reball the mid-layer on the BH13, and finish the joints with your soldering station. Pair it with quality reballing kits, solder paste, and flux, and you complete the whole IC-level and PCB repair job on one bench without improvising fixtures. A clean reball starts with clean pads, so wick away old solder, wipe the surface with flux and cleaner, and check for bridges before you reflow. Once the balls form, let the mid-layer cool on the platform so the joints settle without movement, then reassemble the layers and test the board. The base focuses on the iPhone 12 to iPhone 16 Pro Max range, so if your queue includes older iPhone boards, choose a platform built for that generation instead of forcing a fit. Repair shop owners and service centres in Lahore, Karachi, and Islamabad who handle logic board work every day get a fixture that pays for itself, because every clean reball saves a customer's board from replacement. Technicians who train juniors also benefit, since the positioning plates and stencils give beginners a guided, repeatable method that builds good habits from the first board. When you compare mid-layer reballing setups for your workshop, look at holding force, alignment accuracy, and how many stencils come in the box. The 2UUL BH13 MidReball Base 5 in 1 answers all three with its three-magnet grip, its five positioning plates, and its fifteen stencils. Order it from KB GSM Store and add a dependable mid-layer reballing platform to your iPhone motherboard repair setup.
Key Features
Magnetic base with three large built-in magnets that hold the board and stencil firmly
Five positioning plates for accurate mid-layer alignment
Fifteen reballing stencils included in the set
High-quality steel construction that resists wear
High-temperature-resistant build for repeated reflow cycles
Grooved design that makes stencil removal easy
High-precision manufacturing that reduces alignment errors
Compact 130 x 84 x 11 mm body that fits easily under a microscope
Specifications
| Brand Entity | 2UUL |
| Product Entity | 2UUL BH13 MidReball Base 5 in 1 Magnetic Reballing Platform |
| Technology Entity | Magnetic positioning, BGA stencil reballing, mid-layer (interposer) reballing |
| Compatible Device Entities | iPhone 12, iPhone 13, iPhone 14, iPhone 15, iPhone 16 series up to Pro Max |
| Repair Process Entity | Mid-layer reballing, BGA reballing, iPhone logic board microsoldering |
| Industry Entity | Mobile phone repair, PCB repair, microsoldering, board-level repair |
Compatible Devices
iPhone 12 series (up to Pro Max)
iPhone 13 series (up to Pro Max)
iPhone 14 series (up to Pro Max)
iPhone 15 series (up to Pro Max)
iPhone 16 series (up to Pro Max)
Common Repair Uses
Mid-layer reballing on iPhone 12 to 16 Pro Max logic boards
Repairing dead phone, boot loop issue, and hang on logo faults caused by weak middle layer solder joints
Fixing charging issue and network issue faults linked to mid-layer joint failure
Reballing after layer separation and pad cleaning
Training beginners in repeatable stencil-based reballing