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Brand: 2UUL

2UUL BH16 NAND REBALL BASE Magnetic Dual-Sided Reballing Platform Set

2UUL BH16 NAND REBALL BASE Magnetic Dual-Sided Reballing Platform Set

Regular price Rs.3,800.00 PKR
Regular price Sale price Rs.3,800.00 PKR
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The 2UUL BH16 NAND REBALL BASE Magnetic Dual-Sided Reballing Platform Set holds your NAND chip and stencil steady while you apply solder paste, so you reball cleaner and redo fewer boards. Strong magnets lock the stencil in place, the dual-sided base handles two NAND layouts on one platform, and the set comes with BGA110 and BGA315 stencils that cover iPhone series NAND and other BGA NAND chips. The synthetic stone and steel body takes hot air station heat without deforming. If your bench handles dead phone, boot loop issue, or dead after flash repairs that trace back to the NAND chip, this platform speeds up your reball step. Order from KB GSM Store Pakistan.

SKU:MST-SOLDERING-TOOLS-1171

⚖️ Weight: 0.15 kg

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Description

The 2UUL BH16 NAND REBALL BASE Magnetic Dual-Sided Reballing Platform Set gives your repair bench a fixed, repeatable way to reball NAND flash chips, and it solves the problem that slows most technicians down: a stencil that shifts while you spread solder paste. When a phone arrives with a dead phone complaint, a boot loop issue, hang on logo, or dead after flash, and your diagnosis points to the NAND chip, the reball step decides whether the chip goes back onto the board clean or returns to your bench a second time. This platform holds the chip and the stencil in a fixed position so your hands stay free for the paste and the squeegee. The built-in magnets grip the stencil firmly, which keeps the apertures centered over the pads and cuts down on solder bridges and misaligned balls during paste application and hot-air heating. You place the chip, set the stencil on the magnetic base, apply paste, heat, and lift the stencil without chasing a moving template across the platform. The base has two usable sides, so you handle different NAND layouts on one platform instead of swapping fixtures mid-job, which matters when your repair queue mixes different chip sizes in a single day. The set comes with BGA110 and BGA315 stencils, two NAND package layouts that cover iPhone series NAND, and it also suits BGA-type NAND in other smartphones and tablets that follow the same layouts. The platform body combines synthetic stone with steel, and that construction handles the heat of your hot air station without deforming, so the base stays flat job after job. A flat base gives you an even surface for the stencil, and an even stencil gives you consistent ball height across the whole chip. Pair it with a reliable Hot Air Station or a temperature-controlled Soldering Station, keep your airflow low so the wind does not blow paste off the stencil, and lift the stencil once the solder balls form. A Microscope over your bench lets you inspect every ball before you reflow the chip onto the board, and Multimeters help you confirm continuity and catch shorts once the NAND sits back on the PCB. Keep PCB Holders nearby to grip the motherboard steady while you work on the chip. If you already own Reballing Kits with solder paste, cleaning flux, and tweezers, the BH16 slots into that workflow without changing how you work. For technicians who also work with ISP Pinout Tools, eMMC Programmers, UFS Adapters, or Test Boxes, the BH16 handles the reballing side of NAND work while those tools cover the reading and programming side. It fits the way NAND work runs on a Pakistani repair bench, where one technician often handles chip removal, cleaning, reballing, and refitting personally instead of sending the board out. Shop owners and service centers benefit most, because a single platform that takes two chip layouts reduces the number of loose fixtures on the bench and shortens setup time between jobs. Beginners get a steadier starting point, since the magnetic hold removes the hardest part of reballing, which is keeping the stencil still, and experienced technicians get faster, more repeatable results across a full day of boards. 2UUL builds the BH16 as the NAND-specific base in its reballing range, while the BH17 covers CPU work, so you choose the base that matches the chip on your board instead of forcing one platform to do every job. Clean the stencil after each job, wipe residue off the magnetic surface, and store the platform flat so the magnets keep their grip. Add the 2UUL BH16 NAND REBALL BASE Magnetic Dual-Sided Reballing Platform Set to your NAND repair setup and cut down the reballing errors that cost you time and boards.

Key Features

Dual-sided base lets you work with different NAND or BGA chip layouts on one platform

Strong built-in magnets hold the stencil firmly in place during paste application

Magnetic hold keeps apertures centered over the pads and reduces solder bridging and misalignment

Built specifically for BGA-type NAND flash in smartphones and tablets

Comes with BGA110 and BGA315 stencils for common NAND packages, including iPhone series NAND

Synthetic stone and steel construction resists deformation from hot air station heat

Heat-stable body stays flat for consistent stencil contact across repeated jobs

Suits daily professional use in repair shops and service centers

Specifications

Brand Entity 2UUL
Product Entity 2UUL BH16 NAND REBALL BASE Magnetic Dual-Sided Reballing Platform Set
Technology Entity Magnetic stencil fixation, dual-sided reballing base, BGA110 and BGA315 stencil layouts
Compatible Device Entities iPhone series NAND, smartphone and tablet BGA NAND flash
Repair Process Entity NAND reballing, BGA solder ball planting, hot-air rework
Industry Entity Mobile phone repair, PCB repair, GSM repair tools in Pakistan

Compatible Devices

iPhone series NAND flash chips

BGA-type NAND flash used in smartphones and tablets

NAND packages that match the BGA110 and BGA315 stencil layouts

Common Repair Uses

NAND chip reballing after removal from the motherboard

Solder ball planting with paste and stencil on BGA NAND chips

Storage upgrade and memory replacement jobs on mobile motherboards

Data recovery work that needs the NAND chip reballed before refitting

Repair of dead phone, boot loop issue, hang on logo, and dead after flash faults when diagnosis traces back to the NAND chip

FAQ

What is the product name?
The product name is 2UUL BH16 NAND REBALL BASE Magnetic Dual-Sided Reballing Platform Set.
What is the brand of this product?
The brand of this product is 2UUL.
What is the model of this product?
The model of this product is BH16.
What is this product used for?
This product is used for reballing NAND flash chips with a magnetic, dual-sided platform that holds the stencil steady during solder paste application.
Which devices are compatible with this product?
This product is compatible with iPhone series NAND and other BGA-type NAND flash in smartphones and tablets that follow the BGA110 and BGA315 layouts.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Can the 2UUL BH16 reball CPU chips?
No. The BH16 is built for NAND flash chips. 2UUL sells the BH17 CPU REBALL BASE for CPU reballing work.
Which stencils come with the 2UUL BH16 NAND REBALL BASE?
The set comes with BGA110 and BGA315 stencils, which cover common NAND packages including iPhone series NAND.

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