2UUL BH41 TR-X-11 MID REBALL BASE Magnetic Platform Set
2UUL BH41 TR-X-11 MID REBALL BASE Magnetic Platform Set
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The 2UUL BH41 TR-X-11 MID REBALL BASE Magnetic Platform Set gives your repair bench a dedicated middle layer reballing platform for iPhone X, XS, XS Max, 11, 11 Pro, and 11 Pro Max logic boards. You seat the board on the positioning plate, lay a stencil over the pads, and let the magnetic platform design keep everything steady while you tin the middle layer joints. The set includes 1 positioning plate and 5 stencils, so you start double-stacked board work straight away. Repair shops and service centers in Pakistan use this type of fixture to bring dead phone and boot loop issue boards back to life after a board-level hardware fault.
SKU:MST-SOLDERING-TOOLS-1183
⚖️ Weight: 0.3 kg
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Description
When an iPhone X, XS, XS Max, 11, 11 Pro, or 11 Pro Max reaches your repair bench dead after a drop, a liquid hit, or a failed reflow, the fault often hides in the double-stacked logic board, and the 2UUL BH41 TR-X-11 MID REBALL BASE Magnetic Platform Set gives you a dedicated fixture for repairing that middle layer. These models sandwich two board halves together with solder joints between them, so a hairline crack or a lifted contact there can leave you with a dead phone, a boot loop issue, a hang on logo fault, or a stubborn charging issue that no software fix touches. The BH41 set answers that hardware fault with a middle layer BGA reballing platform, and it ships with 1 positioning plate and 5 stencils so you start tin planting the moment you unbox it. The magnetic platform design holds the plate and stencil steady while you work, which matters because a shifted stencil forces you to wipe the pads and start over. Start the job the way experienced technicians do: measure the rails with a multimeter, inspect the board under a microscope, and confirm the fault points to the middle layer before you commit to a separation. Then mount the board in your PCB holder, heat it with a hot air station or preheater, and lift the two halves apart with steady, controlled temperature so you protect the pads and the neighboring components. Clean both mating surfaces with flux and a fine tip from your soldering station, set the board on the positioning plate, lay the matching stencil over the pads, and press solder paste through the openings. Reflow the paste with your hot air station, peel the stencil away, and check every ball under the microscope before you rejoin the halves. That workflow turns a risky freehand job into a controlled, repeatable procedure, and you spend your time on diagnosis and inspection rather than fighting alignment. Because one set covers the iPhone X to iPhone 11 Pro Max range, you keep bench space tidy and cut the number of separate fixtures you buy for a busy workshop. Repair shop owners and service centers across Pakistan choose this kind of platform when they take on board-level iPhone work in volume, since every recovered logic board saves the customer a full motherboard replacement and keeps the job profitable for you. The set fits into a larger reballing workflow, so pair it with quality soldering stations, hot air stations, microscopes, multimeters, PCB holders, and the other tools in our reballing kits category to build a complete iPhone board repair setup. When you move on to iPhone 12 series and later boards, look for a platform that targets those layouts, because the plate and stencil layouts here serve the X, XS, XS Max, 11, 11 Pro, and 11 Pro Max range. Keep the stencils clean after every use, store the positioning plate flat, and handle the parts gently so the openings stay crisp for your next repair. If your bench already handles CPU and NAND work, this platform adds a focused middle layer capability that sits naturally beside your existing reballing stencils in the same repair process. Choose the 2UUL BH41 TR-X-11 MID REBALL BASE Magnetic Platform Set when you want a purpose-built way to service iPhone X to iPhone 11 Pro Max middle layer joints with confidence.
Key Features
Middle layer BGA reballing platform built around the iPhone X to 11 Pro Max logic board range
Magnetic platform design holds the plate and stencil steady during tin planting
Includes 1 positioning plate to seat the board consistently on every pass
Includes 5 stencils for middle layer solder ball application
Supports double-stacked logic board repair after board separation
Fits the multimeter, microscope, hot air station, and soldering station workflow on your bench
Covers six iPhone models with one set, which reduces the fixtures your workshop stocks
Suits repair shops, service centers, and technicians who handle board-level iPhone jobs in volume
Specifications
| Brand Entity | 2UUL |
| Product Entity | BH41 TR-X-11 MID REBALL BASE Magnetic Platform Set |
| Technology Entity | Middle layer BGA reballing, magnetic positioning platform, stencil-based tin planting |
| Compatible Device Entities | iPhone X, iPhone XS, iPhone XS Max, iPhone 11, iPhone 11 Pro, iPhone 11 Pro Max |
| Repair Process Entity | Middle layer tin planting, double-stacked logic board reballing, PCB rework |
| Industry Entity | Mobile phone repair, board-level iPhone repair, Pakistan repair market |
Compatible Devices
iPhone X
iPhone XS
iPhone XS Max
iPhone 11
iPhone 11 Pro
iPhone 11 Pro Max
Common Repair Uses
Middle layer reballing on double-stacked iPhone logic boards
Tin planting the middle layer contacts after separating the two board halves
Board-level recovery of dead phone, boot loop issue, and hang on logo cases traced to middle layer joints
Rework after a failed reflow or a drop or liquid-related hardware fault on the middle layer
Repeatable, aligned solder ball application on busy repair benches