Amaoe 28in1 Middle Layer iPhone X-16PM Bga Reballing Stencil Set

Amaoe 28in1 Middle Layer Reballing Set for iPhone X to 16 Pro Max Repair Every technician who opens a layered iPhone knows the problem. The middle layer carries hundreds of tiny solder balls, and one careless lift ruins a whole logic board. The Amaoe 28in1 Middle Layer iPhone X-16PM Bga Reballing Stencil Set gives you a model-specific stencil for each layered board from iPhone X to iPhone 16 Pro Max, so you plant fresh tin instead of guessing. You keep one organized kit on your repair bench, not a drawer of loose stencils, when a 12 Pro Max arrives on Monday and a 15 Pro follows on Tuesday. Shops that handle dead phone, charging issue, and network issue jobs on newer iPhones need this kind of coverage. The set targets one job: clean, even solder balls on the middle layer frame. Check the model list below before you order, because the 28in1 set does not cover iPhone 16e.How the Set Fits Your Middle Layer Workflow You start after you separate the two boards with your hot air station. Clean the old solder off the middle layer pads with flux and braid, and keep the board flat while you work. Then seat the board in the matching positioning plate and lay the 0.12mm stencil over it. Align every aperture with its pad under your microscope before you touch any tin. Spread your solder paste across the stencil, scrape it clean, and heat it gently until the balls form. Lift the stencil only after the board cools, so you do not smear the fresh balls. This workflow replaces the old habit of freehand reballing, which wastes time and often leaves bridged joints.Magnetic Base and Positioning Plates The base carries three built-in strong magnets, and they hold the stencil firmly against the board. A stencil that slips even a fraction of a millimetre gives you a poor tinning result, so this grip matters on every job. The positioning plates lock the middle layer in place, which lets you work with both hands free. Heat resistance and solder isolation boards protect the areas you do not want to touch while the hot air runs. A tin insulation pad and a scraping blade round out the kit, so you do not need to hunt for extras. You get a repeatable setup, and that is what separates a clean reball from a second attempt.Model Coverage and Real Repair Jobs The 28in1 set covers layered iPhone motherboards from iPhone X through iPhone 16 Pro Max. That includes the X, XS, and XS Max, the 11 Pro and 11 Pro Max, and the full 12, 13, 14, 15, and 16 series. Technicians reach for it when a drop leaves a dead phone with cracked middle layer joints. It also helps with a boot loop issue or a hang on logo that points to a broken connection between the two boards. Heat damage from a previous bad repair often needs the same treatment. When you plan an IC change karna job near the middle layer, a fresh set of balls gives the board a stable base before you close it up.Where This Set Sits in Your Toolkit This set works best next to a good hot air station, a soldering station, and a microscope. Pair it with a PCB holder to keep the board steady, and keep a reballing kit nearby for individual chips. These tools cover the full path from board separation to final testing. If your shop starts seeing newer models, look at a wider-coverage Amaoe middle layer platform that extends past iPhone 16 Pro Max. For Pakistani repair shops, one dependable middle layer set saves hours each week and cuts down on boards you cannot recover.