Amaoe HW-17 Stencil

Amaoe HW-17 Stencil: One Template for the SM6375 and MT6833V Board Family When a Honor or Huawei board lands on your bench dead after a drop or a bad reflow, the CPU often needs a fresh set of solder balls before anything else makes sense. The Amaoe HW-17 Stencil targets that exact job for the Snapdragon 695 (SM6375) and Dimensity 810 (MT6833V) families. Amaoe cuts the apertures into 0.12mm steel, so you get a template that matches the pad layout of these chips instead of a guess-and-adjust universal sheet. You align it on the cleaned IC, push your solder balls through, and reflow. This page walks you through what the layout covers, how it behaves on your repair bench, and where it sits in your reballing kit.What the HW-17 Layout Covers The Amaoe HW-17 Stencil is a general series template, so one sheet carries more than the main CPU pattern. Listings for this model name the SM6375 and MT6833V processors alongside BGA254, 429, 9902-11, MT6365VPW, MT6190MV, SDR735, QPM5577, VC7643, QDM3301, WCN3988, MT6315NP, PM6375, MT6360UP and RT9759. That list shows you the sheet spans processor, power and supporting IC positions around the same board family. You still confirm the exact marking on your motherboard before you pick a section, because each pattern fits one footprint only. Amaoe positions this stencil for Honor X30, X30i, X40 and Huawei nova 9 SE phones. The 0.12mm thickness stays consistent across the whole sheet, so you keep one routine for every IC you reball with it.Using It on Your Repair Bench Start by lifting the CPU with your hot air station and cleaning the pads until they sit flat and bright. Align the square holes of the Amaoe HW-17 Stencil over the pads, hold it steady with heat-safe tape or a stencil holder, and press your solder balls or paste through the apertures. The Japanese steel sheet is hard, so it keeps its shape while you apply heat, and it lifts away without dragging the balls with it. After you reflow and peel the stencil off, you check every pad for missing or merged balls before you seat the IC back on the board. Rinse the stencil with flux remover and you reuse it on the next job. You follow this routine for IC change karna on dead phone cases, hang on logo faults, and boot loop issue after CPU rework.Where It Fits in Your Reballing Kit Place the Amaoe HW-17 Stencil in the Honor and Huawei section of your stencil collection, next to your other Amaoe HW series templates. It belongs to the BGA reballing stencil category, so you pair it with a Hot Air Station for lifting and reflowing, a Microscope for pad inspection, and a PCB Holder to keep the board steady. If you also repair MediaTek boards from other brands, check Amaoe’s separate MTK stencils, because those cover different footprints. When your workload grows toward heavier CPU jobs, a reballing platform with a magnetic positioning base gives you the next step up from a loose stencil. Keep this template flat in a stencil organizer so the apertures stay clear for your next charging issue or network issue repair.