Amaoe UAV2 BGA Reballing Stencil

UAV2 BGA Reballing Stencil

The Amaoe UAV2 BGA Reballing Stencil is designed for high-precision reballing of BGA chips used in drones and mobile devices. This stencil is compatible with a wide range of BGA chip sizes, including BGA96, BGA60, BGA200, BGA84, BGA178, and BGA63. Ideal for technicians and repair professionals, this stencil ensures accurate and reliable results when reballing chips like A9-A1-RH, DM365ZCE30, and STM32F BGA63.

Key Features:

• Wide Compatibility: Supports multiple BGA chip sizes such as BGA96, BGA60, BGA200, BGA84, BGA178, BGA63,A9-A1-RH,DM365ZCE30,ATSAME70Q21,STM32F,ATSAME70N19, and more.
• High Precision: Ensures accurate reballing for efficient repairs.
• Versatile: Suitable for drone and mobile device BGA chip repairs.
• Durable Material: Built to withstand repeated use in a professional repair environment.

Package Includes:

• 1 x Amaoe UAV2 BGA Reballing Stencil

Amaoe UAV2 BGA Reballing Stencil Best Price in Pakistan