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i2C Q1 Blade Set CPU IC Prying Glue Removal Tool

i2C Q1 Blade Set CPU IC Prying Glue Removal Tool

Regular price Rs.2,200.00 PKR
Regular price Sale price Rs.2,200.00 PKR
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i2C Q1 Blade Set for CPU and IC Glue Removal

The i2C Q1 Blade Set CPU IC Prying Glue Removal kit gives you one aluminum alloy handle and four high carbon steel blades for everyday board-level work. You scrape hardened glue, clear old tin, and pry CPU or NAND chips without fighting a weak edge. The high-temperature resistant solder blades stay firm when you heat the board with your hot air station, so your IC change karna jobs stay clean and controlled. Technicians who handle dead phone, boot loop issue, and hardware fault boards will find this set a practical addition to the repair bench. Check the price in Pakistan at KB GSM Store and order your set today.

SKU:MST-SOLDERING-ACCESSORIES-1150

⚖️ Weight: 0.1 kg

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Description

i2C Q1 Blade Set CPU IC Prying Glue Removal: Control for Every Board Repair.The i2C Q1 Blade Set CPU IC Prying Glue Removal kit puts one aluminum alloy handle and four high carbon steel blades in your hand for the jobs that slow down every board-level repair. You scrape hardened glue, clear old solder, and pry CPU or NAND chips off the PCB with one compact tool. Any technician who handles dead phone cases, boot loop issue boards, or a hardware fault after a drop knows that a weak blade slips and lifts a pad with it. The Q1 set gives you a firmer, more controlled option for that work.Glue and Solder Control on the Board.Underfill and edge glue decide how clean your IC change karna job turns out. The Q1 blades use high-temperature resistant solder blade construction, so you warm the glue with your hot air station and cut into it without the blade losing its edge. You work along the chip border in short strokes, lift the softened glue in layers, and keep the pads under the chip intact. The same blades scrape leftover solder paste and tin from the board, which gives you a flat, clean surface before you reball or place a new chip. High carbon steel holds its shape under pressure, and the aluminum alloy handle gives your fingers a stable grip during long sessions on charging issue or network issue boards. Rotate the four blades through the job: keep one for prying and use the others for glue and tin scraping, so your pry edge stays sharp longer.Where It Fits in Your Repair Workflow.Start with diagnostics under your microscope, then decide whether the fault sits on the CPU, the NAND, or a nearby IC. Once you confirm the fault, you heat the board evenly, slide a Q1 blade under the chip edge, and pry gently while the solder stays soft. Never force a cold chip, because that rips pads and turns a simple hang on logo case into a dead board. After the chip comes off, you switch to a scraping blade and clean the glue and old tin from the pads. Then you move to your reballing kit, stencil, and soldering station for the next step. This order keeps your jumper lagana work to a minimum and protects the traces around the chip. Wipe each blade after use so dried glue never builds up on the edge.Choosing the Q1 Kit for Your Shop.Pakistani repair shops want tools that last through daily rush hours, and the Q1 kit fits that need at a practical price in Pakistan. The set suits phone and laptop motherboards, so one purchase covers both your mobile and PCB repair jobs. The compact handle-and-blade format sits easily in your tool tray, and your whole team can share it across the bench. Pair it with a hot air station, a PCB holder, a good microscope, and a reballing kit for a complete board-level setup from KB GSM Store. If your work involves more chip types and edge glue patterns, you can step up to the i2C Q5 blade kit, which gives you five inserts for wider coverage. For a technician who needs a reliable first glue removal set, the i2C Q1 Blade Set CPU IC Prying Glue Removal kit delivers the right mix of control, durability, and value.

Key Features

  • One Q1 handle with four interchangeable blades
  • Aluminum alloy handle for a firm, stable grip
  • High carbon steel blades that hold their edge under pressure
  • High-temperature resistant solder blades for use with hot air
  • Removes hardened glue from motherboards and around chips
  • Scrapes solder paste and old tin from pads
  • Pries IC and CPU chips off the PCB
  • Works on BGA and NAND chips in phone and laptop repair

Specifications

Brand Entity i2C
Product Entity i2C Q1 Blade Set CPU IC Prying Glue Removal
Technology Entity High-temperature resistant solder blades, high carbon steel blade, aluminum alloy handle
Compatible Device Entities Phone motherboards, laptop motherboards, PCB BGA CPU and NAND chips
Repair Process Entity Glue removal, solder and tin scraping, IC and CPU prying, NAND removal
Industry Entity Mobile repair industry, PCB repair

Compatible Devices

  • Universal — not device-specific
  • Mobile phone motherboards (PCB BGA CPU and NAND chips)
  • Laptop motherboards

Common Repair Uses

  • Removing underfill and edge glue around CPU and NAND chips before IC change karna
  • Scraping solder paste and old tin from pads before reballing
  • Prying CPU, NAND, and other BGA chips off the PCB after heating
  • Cleaning residual glue from the board in dead phone and boot loop issue repairs
  • Preparing the board for a new chip in hardware fault and charging issue jobs

FAQ

What is the product name?
The product name is i2C Q1 Blade Set CPU IC Prying Glue Removal.
What is the brand of this product?
The brand of this product is i2C.
What is the model of this product?
The model of this product is Q1.
What is this product used for?
This product is used for glue removal, solder scraping, and prying CPU and IC chips on motherboards.
Which devices are compatible with this product?
This product suits phone and laptop motherboards and is universal, not device-specific.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Kya Q1 blade set se CPU aur NAND chip utha sakte hain?
Yes. The set pries BGA CPU and NAND chips off the PCB. Heat the board first so the solder softens, then pry gently to protect the pads.
Kya Q1 blades hot air station ke saath use ho sakte hain?
Yes. i2C builds the Q1 with high-temperature resistant solder blades, so you can warm the glue with hot air while you scrape or pry.