Every iPhone board technician knows the moment: you lift a charging IC, an audio codec, or a PMIC off an iPhone board with a no power or charging issue, the pads look clean, and now the chip needs fresh balls before it goes back down. The Mechanic UFO Steel Stencils Set For iPhone (X-16PM) 10in1 handles exactly that step. Mechanic builds this kit around its UFO series, a family of round, disc-shaped steel stencils that carry the BGA footprints of iPhone motherboard ICs from the iPhone X generation through the iPhone 16 Pro Max. Ten plates sit in one set, so you stop hunting through loose single-chip stencils every time a different model lands on your repair bench. The round UFO format matters more than it looks. A disc gives your tweezers a stable grip around the edge and lets you rotate the plate quickly to find the correct footprint under the microscope. Mechanic cuts the apertures as square-round holes rather than plain circles, and that hole shape helps solder paste release cleanly and form balls with consistent height. Consistent ball height decides whether the chip sits flat on reflow or tilts and bridges, and that is the difference between a phone that boots and a phone that returns to your counter next week with the same dead phone complaint. The steel resists high temperature, so you can apply hot air directly over the paste-filled stencil to form the balls without warping the plate. A warped stencil lifts at one corner, paste bleeds under it, and you end up with merged balls on fine-pitch ICs; a flat, heat-stable plate avoids that problem across repeated reballing cycles. The workflow stays simple. Clean the removed IC with flux and desoldering wick on your soldering station until every pad shines. Pick the matching footprint on the correct UFO plate, align the chip under the apertures, and hold everything steady in a PCB holder or reballing fixture. Spread solder paste across the holes with a scraper, wipe off the excess, then heat evenly with your hot air station until the paste turns into bright, round balls. Let it cool, lift the stencil, inspect the result under the microscope, and the IC is ready to go back on the board. Technicians across Pakistan face this job daily on iPhone boards that arrive with charging problems, audio faults, network issue, display faults, or a phone stuck hang on logo after a drop or liquid damage. When the fault traces to a cracked solder joint under a BGA chip, reballing and resoldering the IC often brings the board back without replacing expensive parts, and that saves your customer money while protecting your shop margin. This set covers the iPhone X, XS, XS Max, and XR, plus the full 11, 12, 13, 14, 15, and 16 series including Mini, Plus, Pro, and Pro Max variants, which keeps most of the iPhone traffic in a Pakistani repair shop inside one kit. Know what this set targets before you order. It handles individual motherboard ICs; sandwich-board mid-layer reballing on iPhone X and later logic boards needs a dedicated mid-layer tinning platform with its own frame stencils, which Mechanic sells as a separate product. Build the rest of your reballing setup around this kit for clean results: a hot air station with stable airflow, a temperature-controlled soldering station for pad cleaning, a stereo microscope for alignment and inspection, a PCB holder to keep the board steady, quality solder paste and flux from our reballing kits category, and a multimeter to check for short circuits before and after you reinstall the chip. Model-specific plates cut the time you lose matching footprints by eye on universal stencils, and they give trainees in technical institutes a repeatable reference for every iPhone generation they practice on. For repair shops, mobile service centers, and training institutes in Lahore, Karachi, Islamabad, and the rest of Pakistan, KB GSM Store stocks the Mechanic UFO stencil range with nationwide delivery, so you keep a dedicated iPhone reballing kit at your own bench instead of borrowing one from the shop next door.