PM8350BHS 001 Power IC - Qualcomm PMIC

The PM8350BHS 001 Power IC is a Qualcomm power management chip from the PM8350 series, and you meet it when a Qualcomm-based board arrives as a dead phone, a charging issue or a display problem with no clear software cause. Qualcomm platform files list the PM8350B family next to the PM8350, PM8350C, PMK8350 and PMR735 companion chips, so the part works as one member of a PMIC group on the board, not as a lone chip. Kernel documentation for the related PM8350B shows GPIO support and a single LDO regulator that mostly powers display driver ICs. That detail matters on your bench, because a failed power rail often shows up first as a missing backlight, a blank screen or a phone that never wakes. You start diagnosis with a DC power supply on the battery connector. A dead phone that draws no current, or a board that pulls a steady short-circuit current, points you toward the power section. You then confirm with a multimeter, check the nearby capacitors and filter parts, and use a thermal camera or a drop of rosin to find the hot component. When the PM8350BHS 001 runs hot or shows a shorted rail, the IC change karna job begins. Read the marking on the old chip under your microscope before you order, because the PM8350 series includes several variants that look similar but do not swap freely. Match the full marking, including the BHS and 001 suffix, against the chip on your board. If the markings do not match, do not force a substitute. Prepare the board before you heat it. Mount it on your PCB holder, shield plastic parts and nearby small components, and apply quality flux around the IC. Preheat the board from below so heat spreads evenly, then use your hot air station with steady airflow to lift the old chip. Set the temperature for the solder type on your board and keep the airflow gentle, so you do not blow neighbouring parts off the pads. Lift the chip with tweezers only when the solder flows fully. Clean the pads with a soldering station, solder wick and flux, and inspect every pad for lifted tracks before you continue. A damaged pad needs a jumper lagana repair before the new chip goes on. You then fit the PM8350BHS 001 Power IC. If your chip arrives without balls, you reball it with a matching BGA stencil and fresh solder paste, then check ball alignment under the microscope. Place the chip on the cleaned pads, align it carefully, and reflow with the same even heat you used for removal. Let the board cool naturally, wash off the flux residue, and test with your DC power supply before you close the phone. Watch the current on first power-up. A normal start with the expected draw tells you the new IC works. A fresh short tells you to recheck alignment and pad condition. After the hardware passes, you test charging, display output, network and boot behaviour. Many technicians also run a software check, because a phone that hangs on logo after a power IC change can still have a flash or boot issue. Use a test box or your usual flashing tool to reflash firmware if the phone does not boot cleanly, then confirm there is no boot loop issue before you hand it back. This part suits shops that handle Qualcomm board repair every week, because it saves time compared with replacing a whole motherboard. It also fits training institutes that teach PCB repair and power IC replacement. Pair it with a reliable hot air station, a soldering station, a reballing kit, a microscope and a multimeter for best results. If you plan to move into heavier rework, a stable hot air station with precise airflow and temperature control is the logical upgrade path from basic setups. Browse the mobile phone ICs and power ICs categories at KB GSM Store for matching chips, and check the board marking every time before you order.