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Brand: QIANLI

Qianli 011 Blades Set Only – 16 Hand-Polished CPU IC Glue Removal & Chip Lifting Blades for Mobile Motherboard Repair

Qianli 011 Blades Set Only – 16 Hand-Polished CPU IC Glue Removal & Chip Lifting Blades for Mobile Motherboard Repair

Regular price Rs.1,350.00 PKR
Regular price Sale price Rs.1,350.00 PKR
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Qianli 011 Blades Set Only is a pack of 16 hand-polished replacement blades for the QianLi 011 scraper system, made for technicians who lift CPUs, NAND, baseband, and WiFi ICs every day. The ultra-thin edges cut through black underfill glue, slide under chips once the solder melts, and help you separate sandwich logic boards without lifting pads or tearing traces. Flat, scraping, and hook profiles let you match the blade to the chip and the glue. This set ships without a handle, so it suits technicians who already own a QianLi handle and need fresh, sharp edges for IC change work, glue cleaning, and board-level repair.

SKU:MST-SOLDERING-TOOLS-1501

⚖️ Weight: 0.01 kg

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Description

Qianli 011 Blades Set Only gives you the replacement blade pack from the QianLi 011 hand-polished scraper system, built for the moment every board-level technician knows well: the CPU sits under a hard layer of underfill glue, and one wrong push tears a pad off the logic board. This pack contains 16 hand-polished blades and no handle, so it suits technicians who already own a QianLi handle and want fresh edges, or shops that burn through blades quickly on daily chip work. QianLi finishes each edge by hand to an ultra-thin profile, and that thin tip lets you slide under the edge of a CPU, NAND, baseband, or WiFi IC once the solder melts under hot air, then lift the chip level instead of prying it at a steep angle. The set mixes flat lifting blades, scraping edges, and hook blades, so you choose the angle of attack based on the chip and the glue rather than forcing one tool to do everything. On iPhone motherboards, a tough black underfill surrounds the CPU and NAND, and you need to clear that edge before any IC change. Run a flat blade along the chip perimeter to cut the glue line, preheat the board, apply hot air, and ease the blade under the package when the solder reaches melting point. A thin, polished edge reduces the lever force you need, and less force means fewer lifted pads, fewer torn traces, and fewer boards that end up as a dead phone after the job. After removal, the same blades help you scrape leftover underfill off the pad array so your reballing stencil sits flat and your new solder balls land cleanly. The hook blades earn their place on sandwich-style logic boards, where the upper and lower boards join through an interposer; you work the hook along the seam while heating and separate the layers without gouging the frame. Sellers list the 011 range for iPhone boards with A7 through A11 generation CPUs, and the blades work just as well on Android boards from Samsung, Oppo, Vivo, Infinix, and Tecno wherever glue holds an eMMC, UFS, PMIC, or CPU in place, because the blade responds to the gap and the glue, not the brand. On a Pakistani repair bench, this covers the jobs that walk in every day: a phone stuck in a boot loop issue because of failing storage, a hang on logo fault traced to the NAND, a network issue that points to the baseband, or a charging issue that needs a PMIC swap. Once you finish the hardware side, you often move the lifted chip to eMMC Programmers or UFS Adapters for reading and writing, or you use ISP Pinout Tools to work on a dead board without removing the chip at all, so this blade set sits at the physical start of that workflow. Pair these blades with a stable Hot Air Station and a temperature-controlled Soldering Station for the heating stage, a PCB Holder to lock the board while you apply blade pressure, and a Microscope so you watch the blade tip enter the gap rather than guessing. When the chip comes off and the pads look clean, a Reballing Kit takes over, and a Multimeter or Test Box confirms the rails and power-on behaviour after reassembly. Because the pack ships without a handle, keep your existing QianLi handle ready and swap edges as they wear; a dull blade demands more force, and more force brings back the pad damage you want to avoid. For repair shop owners, training institutes, and service centers in Lahore, Karachi, Islamabad, and across Pakistan, a spare blade set keeps the CPU and NAND station running without downtime, and it costs far less than a board lost to a blunt scraper. If your technicians handle IC change work, glue cleaning, or board separation regularly, the Qianli 011 Blades Set Only belongs next to your hot air station as a standard bench consumable rather than an occasional purchase.

Key Features

  • Pack of 16 hand-polished blades supplied as a blade-only refill, with no handle included
  • Ultra-thin polished edges slide into the narrow gap under CPU, NAND, and baseband chips
  • Flat lifting blades raise ICs level once the solder melts, reducing pad lifting risk
  • Hook blades work along the seam of sandwich logic boards during separation
  • Scraping edges clear hard black underfill glue around the chip perimeter
  • Cleans leftover glue from BGA pad arrays before reballing
  • Multiple blade profiles let you match the edge to the chip size and glue type
  • Refill format lets technicians with an existing QianLi handle replace worn edges at low cost

Specifications

Brand Entity QianLi (QianLi ToolPlus)
Product Entity Qianli 011 Hand-Polished Replacement Blade Set
Technology Entity Hand-polished ultra-thin alloy steel blades for BGA chip lifting and underfill glue removal
Compatible Device Entities iPhone logic boards (A7–A11 CPU generation), Android motherboards (Samsung, Oppo, Vivo, Infinix, Tecno)
Repair Process Entity CPU/NAND IC removal, underfill glue cleaning, sandwich board separation, BGA pad preparation
Industry Entity Mobile phone board-level repair, PCB rework, GSM hardware repair

Compatible Devices

  • iPhone motherboards with A7, A8, A9, A10, and A11 generation CPUs (seller-listed)
  • iPhone sandwich-style logic boards for board separation work
  • Android motherboards with underfilled CPU, eMMC, UFS, or PMIC chips (Samsung, Oppo, Vivo, Infinix, Tecno)
  • Universal for BGA chip lifting — not tied to a single phone model

Common Repair Uses

  • Cutting and scraping underfill glue around CPU, NAND, and baseband ICs
  • Lifting CPU, NAND, WiFi, and baseband chips during hot air removal
  • Separating upper and lower layers of sandwich logic boards
  • Cleaning residual glue from BGA pads before reballing
  • Preparing boards for IC change work on boot loop, hang on logo, network issue, and charging issue faults

FAQ

What is the product name?
The product name is Qianli 011 Blades Set Only.
What is the brand of this product?
The brand of this product is QianLi.
What is the model of this product?
The model of this product is 011.
What is this product used for?
This product is used for underfill glue removal, CPU and IC chip lifting, and sandwich board separation in mobile motherboard repair.
Which devices are compatible with this product?
This product is compatible with iPhone logic boards with A7–A11 generation CPUs and Android motherboards with underfilled BGA chips; the blades work universally on glued BGA ICs.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does the Qianli 011 Blades Set Only include a handle?
No. This set contains the 16 blades only. You need an existing QianLi 011 handle to use them.
Can these blades lift a CPU or NAND without lifting pads?
Yes, when you use them correctly. Cut the glue line first, heat the chip until the solder melts, then slide the thin edge under the package and lift it level; the thin polished tip needs less lever force, which lowers pad damage risk.

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