1 14
Brand: QIANLI

Qianli 4-in-1 Magnetic Middle Frame BGA Reballing Platform

Qianli 4-in-1 Magnetic Middle Frame BGA Reballing Platform

Rs.6,000.00 PKR
Rs.6,000.00 PKR
Sale Sold out
Shipping calculated at checkout.

Mid-Layer Reballing Platform for iPhone 14 Series

Qianli 4-in-1 Magnetic Middle Frame BGA Reballing Platform for iPhone 14 / 14 Plus / 14Pro / 14Pro Max gives your repair bench a fixed, accurate base for mid-layer tin planting. The magnet holds the middle-frame stencil firmly against the board with no bulge, so paste stays where it belongs. Precise positioning keeps the motherboard locked in place while you work. If you handle dead phone jobs or regular IC change karna work on 14 series boards, one platform covers four models and cuts setup mistakes on every reball.

MST-SOLDERING-ACCESSORIES-1125

⚖️ Weight: 0.02 kg

  • Safe & Secure Payment
  • Fast Delivery
  • WhatsApp Support
View full details

Description

Built for Mid-Layer Tin Planting on the iPhone 14 Series

The Qianli 4-in-1 Magnetic Middle Frame BGA Reballing Platform for iPhone 14 / 14 Plus / 14Pro / 14Pro Max is a soldering tool made for one job: planting fresh tin balls on the middle layer of 14 series motherboards. Your board sits on the base while the magnetic middle-frame stencil locks down on top. Four models share one platform, so you do not need a separate fixture for each handset. Qianli lists it as suitable for the iPhone 14 series.

Precise Motherboard Positioning

Most reballing failures start with alignment. A board that shifts even slightly under the stencil puts tin balls off the pads, and those balls bridge or never seat. This platform holds the motherboard in a set position so the stencil openings line up with the pads each time. Qianli specifically calls out precise positioning for the motherboard, which matters most when you work on a board that a previous tech already opened. Start with a stable board and your paste goes where you planned.

Magnetic Pressing for Clean Tin Balls

The strong magnet inside the platform pulls the stencil flat against the board. A flat stencil leaves less gap for paste to creep under, and it stays put while you spread the solder paste and lift the frame off. Qianli describes this as strong magnetic pressing with no bulge, which means the stencil sits evenly rather than rising at the edges. Keep the stencil flat during the whole process, and your tin balls come out more uniform across the layer.

Where It Fits in Your Reballing Workflow

On the bench, the sequence runs like this. Seat the motherboard in the base, align the middle frame over it, and spread low-temperature solder paste across the stencil. Remove the frame, then heat the paste with your hot air station until it melts. Keep the stencil in the platform while you do this step, and avoid focusing heat straight onto the stencil. Use a microscope to check the pads before and after planting, and keep your reballing kits and PCB holders within reach so the board stays secure through every step. This platform works best as one stage in a full mid-layer repair setup, not as a standalone fix for every dead phone.

Key Features

  • 4-in-1 design covering iPhone 14, 14 Plus, 14 Pro and 14 Pro Max
  • Precise positioning for the motherboard
  • Strong magnetic pressing holds the stencil in place
  • No bulge when the stencil is pressed onto the board
  • Built for middle-layer tin planting on 14 series boards
  • Soldering tool category for BGA reballing work
  • Suitable for iPhone 14 series repair benches
  • One platform for four models reduces bench clutter

Specifications

Brand Entity Qianli
Product Entity Qianli 4-in-1 Magnetic Middle Frame BGA Reballing Platform
Technology Entity Magnetic stencil-holding reballing base
Compatible Device Entities iPhone 14, iPhone 14 Plus, iPhone 14 Pro, iPhone 14 Pro Max
Repair Process Entity Mid-layer BGA tin planting (reballing)
Industry Entity Mobile repair tools, Pakistan

Compatible Devices

  • iPhone 14
  • iPhone 14 Plus
  • iPhone 14 Pro
  • iPhone 14 Pro Max

Common Repair Uses

  • Mid-layer tin planting on 14 series motherboards
  • Reballing the middle-layer BGA pads after board repair
  • Positioning the motherboard for accurate solder paste application
  • Holding the middle-frame stencil flat during paste application

FAQ

What is the product name?
The product name is Qianli 4-in-1 Magnetic Middle Frame BGA Reballing Platform.
What is the brand of this product?
The brand of this product is Qianli.
What is the model of this product?
The model of this product is the Qianli 14 Series 4-in-1 Middle Frame Reballing Platform.
What is this product used for?
This product is used for mid-layer BGA tin planting (reballing) on iPhone 14 series motherboards.
Which devices are compatible with this product?
This product is compatible with iPhone 14, iPhone 14 Plus, iPhone 14 Pro and iPhone 14 Pro Max.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Why does motherboard positioning matter during reballing?
Accurate positioning keeps the stencil openings aligned with the pads. A shifted board puts tin balls off the pads, which causes bridging or missing balls.
Should I apply heat directly to the stencil?
No. Keep the stencil in the platform, remove the middle frame after applying the paste, and heat the paste with a hot air station until it melts.