Qianli Bumblebee Stencil (QS140)

Qianli Bumblebee Stencil (QS140) Price in Pakistan for Samsung CPU Reballing A Samsung A-series phone often arrives dead after a drop, or it hangs on logo even after you reflash it. In many of these cases the fault sits under the CPU, not in the software. The Qianli Bumblebee Stencil (QS140) is built for that job. You lift the CPU, clean the pads, and lay fresh solder balls in the correct pattern. One pattern serves several Samsung models and several chipsets, so your drawer needs fewer stencils. KB GSM Store stocks it for technicians across Pakistan who want a dependable CPU reballing stencil at a shop-friendly price. Which Samsung Boards and Chipsets You Can Reball The stencil carries the CPU pattern for SDM450, SDM660, SM6150, and MT6762 processors. In Samsung terms, that covers the Galaxy A10s (SM-A107F), A6 Plus (SM-A605F), A70 (SM-A705F), and A9 (SM-A920F), and suppliers list it for the A60 to A90 series. Board revisions and regional variants can change the layout, so check your CPU pads under the microscope before you commit. Hold the stencil over the cleaned pads and confirm that every opening lines up with a pad. If the pattern fits, you go ahead. If it does not, pick another Qianli Bumblebee pattern instead of forcing it. This habit stops bridged balls and saves a good CPU from a second rework.Square Holes and Flexible Steel on Your Repair Bench Qianli cuts the openings square with rounded corners. This shape helps your solder balls form rounder and fuller, and it stops the solder from sticking inside the hole. The steel is a selected grade with high flexibility and high-temperature resistance, and Qianli says it performs better than ordinary stencil steel. Fix the CPU in your reballing holder, apply a thin layer of flux, and align the QS140 over the pads. Spread your solder balls, brush away the extras, and heat with your hot air station at the setting your balls call for. Let the board cool before you lift the stencil, so the balls stay seated and your pads stay clean.Where It Fits in Your CPU Repair Workflow You start with a multimeter and a power supply to find the short or the dead rail. Next, remove the CPU with a hot air station or a preheater and clean the pads with flux and solder wick. This stencil handles the reballing step, and a microscope check follows before you refit the chip. This sequence helps with hardware fault jobs such as dead phone, boot loop issue, dead after flash, and hang on logo, where weak CPU joints defeat any software fix. Pair the stencil with a PCB holder, flux, and a good set of solder balls from our Reballing Kits and Hot Air Stations categories. When your jobs grow beyond Samsung, a multi-function universal BGA stencil set gives you a wider range of patterns.