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Brand: RELIFE

Relife RL-044 MQ4 Stencil

Relife RL-044 MQ4 Stencil

Regular price Rs.599.00 PKR
Regular price Sale price Rs.599.00 PKR
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The Relife RL-044 MQ4 stencil is a precision reballing tool built for technicians reworking Qualcomm and MTK power IC, CPU, and RAM chips on Android motherboards. Cut from 0.12mm high-grade special steel with round square hole positioning, it lets you plant solder balls accurately without bridging or misaligned pads during tin planting. The Relife RL-044 MQ4 is matched to chip families including SM8350, SM8450, SM7315, SM7325, MT6833V, and MT6877V, so it fits naturally into a Snapdragon or Dimensity repair workflow. It holds its shape through repeated reflow cycles, which matters when your repair bench runs multiple boards a day.

SKU:MST-SOLDERING-TOOLS-840

⚖️ Weight: 0.01 kg

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Description

Working on a dead board with a suspect power IC or CPU fault means the reballing stage has to be right the first time, and the Relife RL-044 MQ4 exists to remove the guesswork from that step. This stencil is CNC laser-cut from 0.12mm special steel, thin enough to sit flush against the chip footprint while staying tough enough to survive repeated hot air and reflow cycles without warping or losing hole shape. The round square hole design is what actually makes the difference on your bench, because it lets solder paste release cleanly during tin planting instead of leaving thin or uneven balls that cause dry joints after reassembly. You get consistent, evenly heated solder points across the mesh, which cuts down the retries technicians usually run into when a stencil flexes or shifts mid-process. The Relife RL-044 MQ4 is built for the MQ series of Qualcomm and MTK power IC, CPU, and RAM footprints, covering chip families such as SM8350, SM8450, SM7315, SM7325, MT6833V, and MT6877V, so it lines up with boards you are already seeing come through for charging issue, hang on logo, and dead after flash complaints where the power IC or CPU is the likely fault. Reballing with the correct stencil matters more than most technicians give it credit for, because a mismatched or worn mesh is one of the quiet reasons a board that should have been a clean repair ends up dead again after reassembly. This stencil is meant to sit in that exact stage of your workflow, right after you have pulled the faulty IC, cleaned the pad, and applied flux, and right before you drop it back on the board for reflow. Its compact size makes it easy to store alongside your other MQ series stencils without cluttering the bench, and the hard packaging most units ship in keeps the mesh flat during transit and storage so you are not fighting a bent stencil before you even start the job. For a repair shop or service center handling a steady mix of Snapdragon and Dimensity devices, having the right stencil on hand rather than improvising with a generic one saves real time per board, especially on jobs where the customer is waiting. It also fits naturally into a wider reballing setup, working alongside a BGA rework station, a good flux paste, and a soldering iron or hot air gun rated for the reflow temperatures these chips need. Technicians moving between ISP, EMMC, and UFS jobs on the same bench will find the Relife RL-044 MQ4 slots into that broader workflow without needing a separate calibration step, since it is measured against real device layouts rather than generic hole spacing. For anyone running a busy GSM workshop in Pakistan, keeping a full MQ1 through MQ4 set on hand means fewer stalled jobs waiting on the correct stencil to arrive, and the RL-044 MQ4 specifically covers the newer flagship and upper mid-range chipsets that are becoming more common on the repair queue.

Key Features

  • Exact-match design for Qualcomm and MTK power IC, CPU, and RAM footprints
  • 0.12mm CNC laser-cut special steel construction
  • Round square hole positioning for cleaner solder paste release
  • High-temperature resistance with minimal deformation across reflow cycles
  • Compact, lightweight build for easy bench storage
  • Precise pin alignment matched to real chip layouts
  • Reusable across repeated reballing jobs without losing accuracy
  • Hard blister packaging to protect the mesh from bending in transit

Specifications

Brand Entity Relife
Product Entity RL-044 MQ4 BGA Reballing Stencil
Technology Entity BGA Reballing / Tin Planting
Compatible Device Entities Qualcomm Snapdragon SM8350, SM8450, SM7315, SM7325; MediaTek MT6833V, MT6877V
Repair Process Entity Power IC / CPU / RAM Reballing
Industry Entity Mobile Phone PCB Repair

Compatible Devices

  • Qualcomm Snapdragon SM8350
  • Qualcomm Snapdragon SM8450
  • Qualcomm Snapdragon SM7315
  • Qualcomm Snapdragon SM7325
  • MediaTek Dimensity MT6833V
  • MediaTek Dimensity MT6877V

Common Repair Uses

  • Power IC removal and reballing on Snapdragon and Dimensity boards
  • CPU reballing after boot loop or dead-after-flash faults
  • RAM chip reballing during memory-related hang or bricked board repairs
  • Board-level rework following charging IC failure
  • Reflow and tin planting as part of a full BGA rework workflow

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