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YCS 01 Qualcomm BGA Reballing Stencil

YCS 01 Qualcomm BGA Reballing Stencil

Rs.600.00 PKR
Rs.600.00 PKR
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Snapdragon 855/730/845-SM8150/7150/SDM845 YCS Repair Home Qualcomm Integrated Network-01

MST-SOLDERING-TOOLS-970

⚖️ Weight: 0.01 kg

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Description

YCS 01 Qualcomm BGA Reballing Stencil

Snapdragon 855/730/845-SM8150/7150/SDM845 YCS Repair Home Qualcomm Integrated Network-01

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Package Content

  • 1x YCS 01 Qualcomm BGA Reballing Stencil

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