YCS 06 Qualcomm BGA Reballing Stencil

The YCS 06 Qualcomm BGA Reballing Stencil belongs to the YCS Repairman Qualcomm Comprehensive Network series, and plate number 06 covers the mid-range Snapdragon generation that still fills Pakistani repair shops every day: SDM660, SDM636, SM6125 (Snapdragon 665), SM6150 (Snapdragon 675), SDM670 and SDM710. You find these chips inside handsets like the Redmi Note 7, Redmi Note 8, Mi 8 Lite, Galaxy A70 and Realme 5, and they bring the same hardware faults to your counter again and again: a phone that goes dead after a fall, a board that throws a boot loop issue after water damage, a set that keeps a hang on logo issue even after a clean flash, or a handset with a network issue after someone pressed hard on the shield. Once your diagnosis points to a cracked CPU joint or a failed power IC, the right stencil decides whether the reball takes ten minutes or a full afternoon. The YCS 06 plate carries labeled apertures for the main processors and for the support chips around them, including the PM6150, PM6150L, PM670 and PM670A power management ICs, the SDR660 RF transceiver, the WCN3990 and WCN3980 WiFi and Bluetooth chips, DA9313 and WCD9370 positions, a BGA254 memory footprint, and RF amplifier footprints such as 77920-21 and 7210M-11. Every window carries its chip marking, so you match the IC to its pattern without guessing under the microscope. That breadth pays off on a real repair bench, because you often lift the CPU, find a weak PMIC joint right next to it, and then need a second pattern for the power chip; with YCS 06 both patterns sit on one sheet instead of three separate stencils. The workflow stays simple. Remove the chip with your hot air station, clear the old solder with flux and desoldering wick, and leave the pads flat and clean. Lay the stencil over the chip, line up every aperture with its pad, lock the chip and plate in a reballing platform or PCB holder, spread solder balls or paste across the apertures with a spatula, and reflow with gentle, even hot air until each ball turns bright and round. Let the plate cool before you lift it so the fresh balls keep their shape. Hold the nozzle a little further back than you would for a normal IC, because a flat steel plate spreads heat across the whole chip and gives you more even balls when you avoid concentrating heat in one corner. Check the result under your microscope, wash the flux residue off with IPA, and the chip goes back on the board ready for a power-on test. For technicians who handle Xiaomi, Samsung, Oppo, Vivo and Realme mid-range sets every week, this stencil turns CPU and PMIC reballing into a regular, billable service instead of a job you refuse at the counter. Pair it with the rest of your BGA setup from our Reballing Kits and PCB Holders categories, a good no-clean flux, and a temperature-controlled unit from our Hot Air Stations range, and keep a stereo unit from our Microscopes category on the bench for ball inspection. Technicians who reball Qualcomm chips daily can step up to the full YCS Qualcomm stencil set with a magnetic CPU reballing platform, which holds the plate dead flat and cuts alignment time further. For older boards, the YCS 05 plate covers MSM8953 and SDM450, while YCS 08 handles SM6350, SM7125 and the Snapdragon 720G to 765G family. Order the YCS 06 at a fair price in Pakistan from KB GSM Store and keep one plate ready for every Snapdragon 660 to 710 job that walks through your door.