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Brand: YCS

YCS-DB02 Multi-Function Spudger 9in1 Set

YCS-DB02 Multi-Function Spudger 9in1 Set

Regular price Rs.2,600.00 PKR
Regular price Sale price Rs.2,600.00 PKR
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The YCS-DB02 Multi-Function Spudger 9in1 Set gives your repair bench three 9G handles, six blades, and a metal carry case in one compact kit. You use it to clear glue around the CPU and NAND, lift stubborn parts, and open up mobile phone motherboards before IC change karna. The non-slip textured handle keeps your hand steady on small, crowded boards. The sturdy blades handle repeated bench work on phones, tablets, and other electronic circuits. Order the YCS-DB02 set from KB GSM Store and keep your glue removal tools in one place.

SKU:MST-SOLDERING-ACCESSORIES-939

⚖️ Weight: 0.1 kg

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Description

YCS-DB02 Multi-Function Spudger 9in1 Set: Your Bench Tool for Glue and Chip PrepEvery motherboard job starts with preparation, and rushed prep ruins good repairs. The YCS-DB02 Multi-Function Spudger 9in1 Set covers that stage. You get three 9G handles and six blades, so you pick the right edge for the job instead of forcing one tool to do everything. The set stores in a metal case, so the blades stay together and your workbench stays tidy. Many technicians in Pakistan search for this kind of kit under "price in Pakistan", because a solid blade set saves money on damaged boards.Glue Removal Around CPU and NANDGlue around a CPU or NAND chip makes IC change karna slow and risky. You need a firm blade that gets under the glue without gouging the board. The YCS-DB02 blades give you that firmness, and the handle gives you control while you work. You clear the glue in small passes, keep the pad area clean, and move on to your hot air station with a clear working area. This is the step that decides whether your reballing or chip lift goes smoothly. If you rush it, you risk a hardware fault that was not there before.Disassembly and Daily Bench UseYou do not only use this set for chip work. You also pry, scrape, and separate parts when you open a phone for a charging issue, display problem, or dead phone job. The non-slip textured handle stays secure in your hand even when your fingers pick up flux or residue. The lightweight build cuts hand fatigue, which matters when you open many phones in one shift. A technician who handles repair after repair at a busy shop feels that difference by evening. The same kit works on tablets, electronic circuits, and other digital devices, so one tool covers several kinds of walk-in jobs.Handles, Blades, and CaseThe YCS-DB02 set ships with one metal case, three 9G handles, and six blades. The handle count gives you flexibility, so you keep more than one blade ready on the bench. The case protects the blades from rolling around loose in a drawer, and you carry the whole kit to a customer visit or training session without worry. The blade measures 140x8mm, which suits close work on a crowded board. Pair this set with your hot air station, microscope, and PCB holder for a complete motherboard workflow. When you outgrow it, you step up to a larger rework setup from KB GSM Store, such as a hot air station or soldering station.

Key Features

  • 9-in-1 set with three 9G handles and six blades
  • Non-slip textured handle for stable grip
  • Strong, durable blades for repeated bench use
  • Built for glue removal around mobile phone CPU and NAND chips
  • Metal carry case for safe storage and transport
  • Lightweight design that reduces hand fatigue
  • 140x8mm blade size for tight board areas
  • Suits phones, tablets, electronic circuits, and other digital devices

Specifications

Brand Entity YCS
Product Entity YCS-DB02 Multi-Function Spudger 9in1 Set
Technology Entity Three 9G handles with six blades and metal storage case
Compatible Device Entities Mobile phones, tablets, electronic circuits, other digital devices
Repair Process Entity Glue removal, motherboard disassembly, CPU and NAND chip prep
Industry Entity Mobile repair industry, PCB repair

Compatible Devices

  • Mobile phones
  • Tablets
  • Electronic circuit boards
  • Other digital devices
  • Universal — not device-specific

Common Repair Uses

  • Removing glue around CPU and NAND flash chips before hot air work
  • Disassembling mobile phone motherboards
  • Scraping residue during dead phone and hardware fault repairs
  • Opening tablets and other digital devices for service
  • Prepping boards before IC change karna

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