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Amaoe MU3 (V5.0) Stencil – 0.12mm MTK CPU BGA Reballing Stencil for MT6762V, MT6739V, MT6771V, MT6785V and More

Amaoe MU3 (V5.0) Stencil – 0.12mm MTK CPU BGA Reballing Stencil for MT6762V, MT6739V, MT6771V, MT6785V and More

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The Amaoe MU3 (V5.0) Stencil gives you a 0.12mm BGA reballing template for MediaTek CPU work on your repair bench. It covers MT6260DA, MT6762V/MT6765V, MT6739V, MT6785V, MT6757V, MT6771V, MT6763V and MT6873V/MT6875. You place it over the cleaned chip, spread solder paste through the apertures, and lift a clean, evenly spaced ball pattern after heating. Use it for dead phone, hang on logo and boot loop cases where a CPU change or reflow is needed. Pair it with a hot air station, quality solder paste and a microscope for accurate, repeatable reballing in your Pakistani repair shop.

SKU:MST-SOLDERING-ACCESSORIES-1114

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Description


The Amaoe MU3 (V5.0) Stencil solves one of the most repetitive jobs in MediaTek board repair: putting fresh solder balls back on a CPU after you lift it from the motherboard. If you have ever tried to reball a MediaTek chip by eye, you know how quickly the balls drift, merge or leave empty pads, and how a single bridged corner turns a working repair into another dead phone. This 0.12mm stencil takes that guesswork away by holding the ball positions for you, so your paste sits exactly where the chip pads need it. Amaoe makes the MU3 as part of its MTK CPU stencil series, and the V5.0 version covers several MediaTek chipset families on one plate, including MT6260DA, MT6762V/MT6765V, MT6739V, MT6785V, MT6757V, MT6771V, MT6763V and MT6873V/MT6875. That range matters in a busy workshop, because many budget Android phones that reach Pakistani repair counters run on these platforms, and you no longer need a separate template for every chip that lands on your bench. Your workflow starts after you remove the CPU with a hot air station and clean the old solder off the pads with flux and a soldering iron. You then fix the chip in place, align the matching aperture pattern on the stencil to the pads under your microscope, and spread solder paste across the openings with a flat blade. Once the openings fill, you heat the stencil gently until the paste melts into round balls, let it cool, and separate the stencil from the chip. The 0.12mm thickness sets the volume of paste each aperture holds, which controls the size and height of every ball, so the finished chip sits level when you place it back on the board. Distributor information for this stencil lists a heat tolerance up to 240°C, which covers the melting range of both leaded and lead-free solder. You still need to control your heat, because large stencils can bend under fast temperature rise. Raise the temperature gradually, keep the hot air nozzle moving, and give the plate time to cool flat before you peel it away. Good habits like these protect the apertures and extend the life of the stencil across many jobs. The MU3 fits into the wider CPU repair process that Pakistani technicians handle every day, from a phone dead after flash with a suspected hardware fault, to charging issue boards where the CPU area took damage, to phones that hang on logo and never finish booting. In each case you diagnose first with a multimeter and a power supply, confirm the CPU needs work, and only then reach for reballing. The stencil gives you a repeatable step in that chain instead of a gamble. It also suits shops that offer IC change karna as a service, because consistent ball placement means fewer failed reflows and fewer angry customers returning the same phone. When you build your reballing setup, treat the stencil as one part of a matched kit. A stable PCB holder keeps the board still while you work, a reliable soldering station cleans the pads before you start, and a reballing kit with quality solder paste and flux gives you the raw material for good balls. A digital microscope or stereo microscope lets you check alignment before you heat and inspect the result afterward. If you also handle eMMC or UFS repairs, the same bench discipline carries across, and you can pair this stencil with your existing ISP pinout tools and programmers for full board recovery. Buying the Amaoe MU3 (V5.0) Stencil also makes sense for training institutes and technician courses, because it teaches the correct reballing method on real MediaTek chipsets at a very low cost per student. New technicians learn paste control, temperature discipline and alignment habits without risking an expensive tool. Experienced technicians in busy repair shops get a dependable template they can grab several times a day without thinking about it. Check your chipset marking against the supported list before you order, because the plate only fits the chipset patterns Amaoe built into it. Once you match your chip to the right aperture pattern, you get a clean, professional reballing result that keeps your repair quality high and your bench moving. For any technician who works on MediaTek phones regularly, this stencil earns its place among the small but essential tools on the workshop table.

Key Features

  • 0.12mm thickness for controlled solder paste volume and even ball size
    Covers eight MediaTek CPU chipset families on a single stencil
    Keeps ball positions aligned so you avoid bridged and missing balls
    Handles temperatures up to 240°C, enough for leaded and lead-free solder

  • Works with standard hot air station reballing workflow
    Reduces repeat failures on dead phone and hang on logo CPU repairs

  • Suits repair shops, service centers and technician training institutes

  • Part of the Amaoe MTK stencil series (MU series)

Specifications

Brand Entity Amaoe
Product Entity Amaoe MU3 (V5.0) Stencil, MU3 MTK CPU BGA Reballing Stencil
Technology Entity BGA reballing, 0.12mm stencil template, solder paste ball formation
Compatible Device Entities MediaTek (MTK) CPU chipsets MT6260DA, MT6762V/MT6765V, MT6739V, MT6785V, MT6757V, MT6771V, MT6763V, MT6873V/MT6875
Repair Process Entity CPU reballing, BGA rework, IC change karna
Industry Entity Mobile phone repair, PCB repair, GSM hardware repair Pakistan

Compatible Devices

MediaTek (MTK) CPU chipset: MT6260DA


MediaTek (MTK) CPU chipset: MT6762V / MT6765V


MediaTek (MTK) CPU chipset: MT6739V


MediaTek (MTK) CPU chipset: MT6785V


MediaTek (MTK) CPU chipset: MT6757V


MediaTek (MTK) CPU chipset: MT6771V


MediaTek (MTK) CPU chipset: MT6763V


MediaTek (MTK) CPU chipset: MT6873V / MT6875

Common Repair Uses

Reballing a MediaTek CPU after removal from the motherboard
Replacing a CPU on dead phone boards with a confirmed CPU fault


Repairing boot loop issue and hang on logo cases that trace back to CPU solder joints


Reflowing and restoring solder balls after a hardware fault or drop damage


Preparing a CPU for IC change karna on MediaTek Android phones
Hands-on BGA reballing practice for technician traini

FAQ

What is the product name?
The product name is Amaoe MU3 (V5.0) Stencil.
What is the brand of this product?
The brand of this product is Amaoe.
What is the model of this product?
The model of this product is MU3 (V5.0).
What is this product used for?
This product is used for reballing MediaTek (MTK) CPU chips with a 0.12mm BGA stencil during CPU repair.
Which devices are compatible with this product?
This product is compatible with MediaTek CPU chipsets MT6260DA, MT6762V/MT6765V, MT6739V, MT6785V, MT6757V, MT6771V, MT6763V and MT6873V/MT6875.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Which MediaTek chipsets does the Amaoe MU3 (V5.0) Stencil support?
It supports MT6260DA, MT6762V/MT6765V, MT6739V, MT6785V, MT6757V, MT6771V, MT6763V and MT6873V/MT6875. Match your CPU marking to this list before you order.
Can I use this stencil with lead-free solder?
Yes. Distributor information lists a heat tolerance up to 240°C, which covers the melting range of lead-free solder around 220°C and leaded solder around 183°C. Raise the heat gradually and keep the hot air nozzle moving to avoid warping the plate.