YCS 2023-005 Desoldering Wick (5pcs Roll) 2.0mm Wide Braid

Every technician who has changed a charging IC on a dead phone knows the real work starts after the chip comes off, because the pads underneath carry uneven lumps of old solder that stop a new part from sitting flat. The YCS 2023-005 Desoldering Wick (5pcs Roll) is made for that step. YCS braids each roll from fine pure copper strands, each about 0.05mm thick, into a 2.0mm-wide ribbon, and every roll gives you 2.3 metres of working length. The pack holds five rolls, so a busy counter in Lahore, Karachi, or Islamabad can keep one at every bench and still have spares in the drawer. The 2.0mm width matters more than most buyers realise. A wide 3.5mm braid covers large ground pads and connector rows, but on a crowded phone logic board it also touches neighbouring capacitors and pulls heat into areas you never wanted to warm. A 2.0mm braid lets you work one row of IC pads at a time, clear the solder bridges along a charging port pin line, and clean small PMIC and audio IC footprints without dragging your iron across half the board. The method is simple. Lay the wick flat over the solder you want to lift, press a clean, tinned soldering iron tip on top of it, and let the copper draw the molten solder up into the weave. Once the braid turns silver, lift the iron and the wick together, then trim off the used section with side cutters so the next pass always starts on fresh copper. Pure copper conducts heat well, so the braid reaches solder melting point quickly and your iron spends less time on the pad. That protects the pad from lifting and keeps the PCB solder mask from burning. Technicians who work on boot loop boards, hang on logo faults caused by a failing eMMC, or network faults where an RF IC needs replacing all reach the same step: clean pads before new solder goes down. That step decides whether your reballed chip lands properly or whether the phone comes back to your counter with the same hardware fault a week later. Many experienced technicians add a thin layer of fresh flux to the pad area before they bring in the wick. The extra flux helps old, oxidised solder flow into the braid in a single pass and leaves the pads smooth and flat, ready for a stencil. The distributor describes this braid as low-residue and oxidation-resistant, which helps when you store the rolls for weeks between jobs. Even so, a quick wipe with isopropyl alcohol and a brush after desoldering keeps the area clean before you inspect it under a microscope. This wick belongs to the soldering and rework stage of the mobile repair workflow and works alongside the rest of your setup. Your Soldering Stations and Hot Air Stations handle the heating and chip removal. Your PCB Holders keep the board steady while you drag the braid, and your Microscopes let you confirm that every pad is clean and flat. When you move into BGA work, pair the wick with Reballing Kits so the chip seats evenly. On the software side of a dead phone job, the same clean-pad routine prepares the board for ISP Pinout Tools, eMMC Programmers, and UFS Adapters when you need solid contact points for direct memory access. Multimeters and Test Boxes then help you confirm the repair once the new component is in place. Because this is a consumable, the five-roll pack makes sense for shop owners who buy stock in bulk instead of going to the market every time a roll runs out. It suits individual mobile technicians, service centres that handle display and charging repairs every day, and training institutes where students use up braid quickly while they learn IC change technique. If your bench handles board-level work, the YCS 2023-005 keeps the most basic step of every rework job, solder removal, fast and predictable.