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338S00839 USB Charging IC

338S00839 USB Charging IC

Regular price Rs.650.00 PKR
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The 338S00839, known in the repair trade as the Tigris charging IC, handles USB power delivery and charge management on iPhone 14, 14 Plus, 14 Pro, and 14 Pro Max logic boards. Technicians reach for this chip when a phone shows no charging, intermittent charging, or gets stuck at "Accessory not supported" after liquid damage or a board short. Board-level techs commonly reference it as U4001 on the schematic. This BGA component requires proper reballing and hot air rework skills for a clean reflow. Stock it for your iPhone 14 series charging port and power bench jobs.

⚖️ Weight: 0.01 kg

SKU:MST-IC-289

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Description

When an iPhone 14 series device won't charge at all, or the charging cuts in and out even after you've already swapped the charging port flex, the fault usually sits deeper on the board — at the Tigris IC itself. The 338S00839 sits in the charging power path and manages how the device negotiates power input, so a damaged or corroded chip creates exactly the kind of "dead after flash" or "charging issue" symptoms your customers describe.You'll find this IC on iPhone 14, iPhone 14 Plus, iPhone 14 Pro, and iPhone 14 Pro Max boards, where technicians commonly refer to it by its schematic label, U4001. It replaced the earlier 338S00770 used on the iPhone 13 series and was itself succeeded by the 338S00946 on iPhone 15 boards, so keeping the correct generation in stock matters — installing the wrong revision won't restore charging and can create new faults on the board.Board-level repair on this chip is not a beginner task. You're working with a BGA package, so you need a hot air rework station capable of precise, low-airflow reflow, along with a stencil sized for this chip's ball layout and a reliable reballing process. Rushing the reflow or using excess heat risks lifting nearby pads or damaging adjacent components, so controlled temperature profiling on your rework station matters more here than raw airflow power.In your actual workflow, this chip comes into play on a few recurring jobs. A phone that shows no response to any charger, cable, or power source after a drop or liquid exposure often points here once you've ruled out the charging port and battery connector. A board that charges only at certain angles, or that charges briefly and then stops, points to a cracked or partially lifted IC rather than a fully dead one — reflow first before jumping to a full chip swap. And boards that show charging current on your DC power supply but never register in diagnostics mode also lead back to this IC once the PMU and battery connector test clean.Before you commit to swapping the IC, confirm your diagnosis on the bench. Run the board on a DC power supply and watch the current draw pattern — a short or abnormal draw around the charging power rail narrows things down fast. Cross-check with a multimeter for continuity and shorts around the U4001 pads, and inspect under your microscope for corrosion, lifted pads, or visible damage before you commit to a reflow. Confirming the fault at the component level saves you from reflowing a chip that wasn't actually the problem.Stock genuine 338S00839 chips alongside your existing iPhone 14 series repair inventory — charging port flex cables, battery connectors, and your hot air and reballing toolkit — so you're not stopping mid-job to source a single part. For a shop running regular iPhone 14 series charging repairs, having this IC on the shelf turns a multi-day turnaround into a same-day fix.

Key Features

Genuine 338S00839 Tigris IC matched to iPhone 14 series charging power management

Correct chip generation — won't cross-compatible with iPhone 13 or 15 series boards

Restores stable charging on boards affected by no-charge or intermittent-charge faults

Suitable for BGA reflow and reballing workflows on your existing hot air station

Addresses common liquid-damage and drop-damage charging failures

Works alongside your existing DC power supply diagnostic routine for fault confirmation

Sized correctly for standard iPhone 14 series stencil and reballing kits

A practical stock item for shops handling regular iPhone 14 series charging repairs

Specifications

Brand Entity Apple
Product Entity 338S00839 Tigris USB Charging IC
Technology Entity BGA power management IC, USB charging power path
Compatible Device Entities iPhone 14, iPhone 14 Plus, iPhone 14 Pro, iPhone 14 Pro Max
Repair Process Entity BGA reflow, reballing, charging power-path diagnosis
Industry Entity Mobile phone board-level repair, GSM technician workshop tools

Compatible Devices

iPhone 14, iPhone 14 Plus, iPhone 14 Pro, and iPhone 14 Pro Max logic boards. Not compatible with iPhone 13 series (uses 338S00770) or iPhone 15 series (uses 338S00946).

Common Repair Uses

No-charging and intermittent-charging faults, charging port power-path diagnosis, board-level reflow and reballing after liquid damage or physical shock, and dead-after-drop boards where the charging power rail shows an abnormal current draw.

FAQ

What is the product name?
The product name is the 338S00839 USB Charging IC, also known as the Tigris charging IC.
What is the brand of this product?
This is an Apple-designed component used across genuine iPhone 14 series logic boards.
What is the model of this product?
The model is 338S00839, commonly referenced as U4001 on the schematic.
What is this product used for?
It manages USB charging power delivery on the board and is replaced to fix no-charging or intermittent-charging faults.
Which devices are compatible with this product?
It is compatible with iPhone 14, iPhone 14 Plus, iPhone 14 Pro, and iPhone 14 Pro Max only.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional board-level repair users.
Can I use the 338S00839 on an iPhone 13 or iPhone 15 board?
No — iPhone 13 series boards use the 338S00770 chip and iPhone 15 series boards use the 338S00946; installing the wrong generation won't fix charging and can create a new fault.
Does replacing this IC require a hot air rework station?
Yes — the chip is a BGA package, so you need a hot air station with a suitable stencil and a proper reballing process for a clean reflow.

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