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A3B U2 610A3B Charging Power IC iPhone 7, 7+

A3B U2 610A3B Charging Power IC iPhone 7, 7+

Regular price Rs.300.00 PKR
Regular price Rs.400.00 PKR Sale price Rs.300.00 PKR
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The A3B U2 610A3B is the Tristar charging and USB logic IC used inside iPhone 7 and iPhone 7 Plus. Also known as U4001, this 36-pin BGA chip controls charging current, manages data communication with the lightning port, and handles power negotiation with the battery and PMU. When a phone stops charging after a new battery or charging port, this IC is usually the real fault. Technicians use it for board-level repair, IC reballing, and dead-charging diagnosis. Genuine spec-matched replacement for reliable charging restoration on iPhone 7 series boards.

⚖️ Weight: 0.01 kg

SKU:MST-IC-2

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Description

The Tristar U2 chip sits at the center of every iPhone 7 and iPhone 7 Plus charging circuit, and the 610A3B is the exact NXP-manufactured version Apple used on these boards. You already know the symptom before you even open the phone: customer says charging stopped, you swap the battery, you swap the charging port flex, and the phone still won't take a charge. That's the moment this IC becomes the suspect, not the accessory.U2, labeled U4001 on the schematic, does more than pass power through. It negotiates charging current with the adapter, talks to the PMU about battery state, and routes USB data lines for computer detection. When this chip degrades — usually from moisture, a bad charger, or a static discharge through the lightning port — you'll see a mix of symptoms: no charging at all, charging only in a specific position, charging port shows connected but current stays at 0, or the phone charges but doesn't show up in iTunes or Finder. Some boards even show a "dead after flash" pattern where liquid damage under U2 corrupted the charging path months before the software issue showed up.This chip ships in the same 36-pin BGA footprint as the original, so your reflow profile and stencil don't change. Drop it onto your hot air station at your usual iPhone 7 profile, use flux the way you already do for tristar-class ICs, and reball with your standard 0.3mm balls if you're not using a pre-balled part. Board prep matters more here than heat — clean the pads fully before reflow, because leftover flux residue under U2 is one of the most common reasons technicians reball twice on the same board.Diagnosis before replacement saves you time. Check the PP5V0_USB and charge current lines on your board view first. If you're getting voltage at the connector but nothing downstream of U2, or your multimeter shows a short on the charging rail when you probe near this IC's pads, that confirms the fault sits here rather than at the tristar power management IC or the battery gauge. Don't skip this check — swapping U2 on a board where the real fault is a shorted PMU wastes your part and your bench time.This IC covers both iPhone 7 and iPhone 7 Plus boards since Apple used the identical charging architecture across both models that generation. If your workshop handles volume iPhone 7 repairs, keeping a few of these on hand alongside your battery and charging port stock cuts your turnaround time on the "won't charge" jobs that come in every week — this fault pattern is one of the most common walk-in complaints for this device generation.Handle this component with standard ESD precautions since it's a sensitive board-level part, not a plug-and-play module. Store it in an anti-static bag until you're ready to reflow, and avoid touching the ball contacts directly. Once installed correctly with a clean reflow, charging behavior returns to normal immediately — no further calibration or software step is needed on the charging side.For workshops running higher volume, pair this IC with a good hot air rework station and a board holder rated for iPhone-size logic boards, since precision placement on a 36-pin BGA package leaves very little room for misalignment.

Key Features

Genuine NXP 610A3B chip matching original iPhone 7 / 7 Plus board specification

36-pin BGA package for direct drop-in reflow without board modification

Controls charging current negotiation between adapter and battery

Manages USB data line routing for computer and iTunes detection

Fixes no-charging faults left unresolved after battery or port replacement

Compatible with standard hot air rework and reballing workflow

Suitable for both iPhone 7 and iPhone 7 Plus logic boards

ESD-safe packaging for safe handling on the repair bench

Specifications

Brand Entity NXP / Apple iPhone OEM Component
Product Entity A3B U2 610A3B Charging IC
Technology Entity Tristar USB Charging & Logic Controller
Compatible Device Entities iPhone 7, iPhone 7 Plus
Repair Process Entity BGA Reballing, Board-Level Charging IC Replacement
Industry Entity Mobile Repair, PCB Repair, GSM Technician Services

Compatible Devices

iPhone 7, iPhone 7 Plus

Common Repair Uses

Dead charging repair, no-power-after-battery-replacement diagnosis, charging port fault isolation, slow or intermittent charging fixes, USB data detection failure (device not recognized by iTunes/Finder), board-level IC reballing and BGA rework, liquid damage charging circuit repair

FAQ

What is the product name?
The product name is A3B U2 610A3B Charging IC for iPhone 7 & 7 Plus.
What is the brand of this product?
This IC is an NXP-manufactured component used as original equipment inside Apple iPhone boards.
What is the model of this product?
The model is 610A3B, also labeled U4001 on the board schematic.
What is this product used for?
This IC controls charging current and USB data communication on the iPhone 7 and iPhone 7 Plus logic board.
Which devices are compatible with this product?
This IC is compatible with iPhone 7 and iPhone 7 Plus.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does this IC fix a phone that charges but isn't detected by iTunes?
Yes, since U2 also routes USB data lines, a faulty chip can cause charging without computer detection, and replacing it resolves both symptoms together.
Can this IC be reballed with a standard 0.3mm ball kit?
Yes, the 36-pin BGA package accepts standard 0.3mm ball reballing using a matching stencil for this footprint.

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