Glue removal around CPUs, NAND chips, and BGA packages is one of those repair steps where a wrong move costs you a pad or a chip. The Qianli 011 16-in-1 Multi-Function Glue Removal Knife exists to take that risk out of the equation. Instead of forcing a single blade shape into every job, you get 16 hand-polished copper blades in one kit, each suited to a different angle of attack on motherboard adhesive and chip-level glue. The standard double copper head configuration is the core of this tool's design. Copper sits soft enough to avoid scratching solder pads or gouging trace lines, yet firm enough to lift dried adhesive and separate sandwich-mounted boards without leaving marks behind. When you're prying a CPU off a board after reflow, or cutting through glue holding a NAND chip in place, that balance between softness and rigidity is what keeps your board intact. You'll find the blade variety useful across different repair scenarios. Flat blades handle general glue scraping and edge cleaning. Hook-shaped blades give you leverage to lift ICs from underneath without sliding sideways into neighboring components. Crescent blades work well for tapping into tight gaps around CPU edges before the chip separates, especially once you've hit the tin melting point during hot air rework. Since all 16 blades share one handle, you swap between shapes mid-job instead of reaching for a different tool every time the angle changes. The blades themselves come from Japanese alloy steel, hand polished to a smooth edge. That polishing step matters more than it sounds — a rough-edged blade catches on board surfaces and increases the chance of scratching solder mask or lifting a pad you didn't mean to touch. The smooth finish on these blades lets them glide under adhesive and separate layers cleanly, which is the difference between a controlled chip removal and a board you now need to jumper. Handle design plays into daily usability too. The grip uses a textured, non-slip surface, which matters when you're applying steady pressure for extended periods — cleaning residual glue off a motherboard after chip removal isn't a quick task, and a handle that slips under pressure slows you down and increases risk. On a Pakistani repair bench, this kit fits naturally into iPhone board-level work: CPU change jobs, NAND removal for eMMC data recovery, baseband IC replacement, and general glue cleaning after any chip-level rework. It's equally at home on Android motherboards wherever BGA-mounted ICs need prying or glue separation, since the blade shapes aren't iPhone-specific in function — they just happen to be sized for the tight component spacing you find on smartphone logic boards. Storage is straightforward since all 16 blades and the handle fit into a compact case, so you're not hunting through a drawer mid-repair. For technicians doing volume board-level work — motherboard repair shops, data recovery services, chip-level training centers — having this range of blade shapes on hand cuts down the number of times you reach for an improvised tool that risks damaging a board you can't afford to replace. This isn't a tool you buy once and forget about. Blades wear down with repeated use against dried adhesive, and having the full 16-piece range means you're not stuck mid-job when one blade dulls or bends. It's a practical investment for anyone doing regular CPU, NAND, or PMIC-level rework where glue removal is part of the process.
